Temperature control of individual tools in a cluster tool system

• US 6,247,531 B1
• Filed: 07/18/2000
• Issued: 06/19/2001
• Est. Priority Date: 09/16/1997
• Status: Expired due to Term

• Current Assignee: B/E Aerospace, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: B/E Aerospace Incorporated (Spirit Realty Capital, Inc.)
• Inventors: Cowans, Kenneth W.
• Primary Examiner(s): Yeung, James C.
• Assistant Examiner(s): MCKINNON, TERRELL L
• Application Number:
  US09/618,839
• Time in Patent Office: 336 Days
• Field of Search: 165/206, 165/264, 165/290, 165/107.33, 165/80.4, 622/592, 621/26, 622/01, 361/699
• US Class Current: 165/206
• CPC Class Codes: B23Q 11/10 Arrangements for cooling or lubricating tools or work incorporated in tools, see the relevant subclass for the tool , e.g. B23B27/10, B23B51/06, B23C5/28, B23D77/006; for circular saw blades B23D59/02, for cooling grinding surfaces B24B55/02
• CPC Class Codes: B23Q 11/141 using a closed fluid circuit for cooling or heating
• CPC Class Codes: B23Q 11/143 comprising heating means
• CPC Class Codes: F25B 2309/06 Compression machines, plants or systems characterised by the refrigerant being carbon dioxide
• CPC Class Codes: F25B 2341/0681 the sensor is heated
• CPC Class Codes: F25B 40/00 Subcoolers, desuperheaters or superheaters
• CPC Class Codes: F25B 41/20 Disposition of valves, e.g. of on-off valves or flow control valves expansion valves F25B41/31
• CPC Class Codes: F25B 41/335 via diaphragms
• CPC Class Codes: F25B 41/34 with the valve member being actuated by electric means, e.g. by piezoelectric actuators
• CPC Class Codes: F25B 49/02 for compression type machines, plants or systems
• CPC Class Codes: F25B 5/02 arranged in parallel
• CPC Class Codes: F25B 9/008 the refrigerant being carbon dioxide
• CPC Class Codes: F25D 17/02 for circulating liquids, e.g. brine
• CPC Class Codes: Y02B 30/70 Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Abstract

A temperature control unit for independent control of a number of independent channels, as can exist with a cluster tool used for semiconductor fabrication, has high efficiency, long term life and reliability, and requires only a small floor area. To these ends, the unit employs a single high capacity refrigeration system and disposes a number of separate temperature control channels for the individual tools, with only some channels receiving refrigerant. Low temperature channels use high pressure, sub-cooled refrigerant for chilling the heat transfer fluid to selected levels controlled by proportional valves adjusting refrigerant flow through evaporator heat exchanger units which cool heat transfer fluid. Moderate temperature channels cool the heat transfer fluid for associated tools to an ambient temperature level. The tools may, as needed, be heated by elements in the separate control channels, the control levels for both cooling and heating being determined by servo circuits programmed to measure actual and establish desired temperature levels.

Claims

1. The method of controllably regulating the separate temperatures of at least a number of the tools in a cluster tool comprising the steps of:

passing pressurized heat transfer fluid in individual thermal exchange relation with different separate tools;

providing a single flow of refrigerant having refrigeration capacity adequate for the concurrent refrigeration maximum of at least some of those of the tools that are to be refrigerated below ambient level;

branching the refrigerant into separate heat exchange paths in thermal interchange relation with the heat transfer fluid, one path for each control loop associated with a tool that is to be lowered below ambient temperature;

providing separate control signals representative of the current temperature level desired for the different individual tools; and

individually controlling the temperatures of the heat transfer fluids in each of the separate control loops by varying the temperatures of the refrigerants in those branches to maintain the temperatures of the tools at their desired levels.

2. The method as set forth in claim 1 above, wherein the refrigerant is provided as a high pressure subcooled refrigerant and wherein the step of varying the temperature of the refrigerant in the branches comprises evaporating refrigerant at a rate in each branch responsive to the control signal for the control loop to establish a desired lower temperature.

3. The method as set forth in claim 2 above, wherein the tools are at times to be raised in temperature above the ambient level, and wherein the method further comprises the step of heating the heat transfer fluid in the control loops in accordance with the control signals and the method further comprises the step of returning the refrigerant to a single flow for recompression after evaporation.

4. The method as set forth in claim 3 above, wherein the cluster tool includes at least one tool that need be cooled only to an ambient level, and wherein the method further comprises the steps of providing a coolant at ambient temperature level, passing the ambient temperature level in thermal interchange relation with the heat transfer fluid for the associated at least one control, loop, and varying the temperature of the heat transfer fluid to be provided to the at least one associated tool by varying the flow of the ambient coolant in on/off fashion.

5. A method as set forth in claim 4 above, further including the step of varying the rate of evaporation of refrigerant in the different branches by proportional control including a temperature responsive compressible fluid in each branch, and further initiating rapid cooldown by a separate flow of low temperature evaporated refrigerant at cooldown transitions indicated by the control signals.

6. The method for controllably regulating the separate temperatures of different devices with a single temperature control unit comprising the steps of:

passing pressurized heat transfer fluid in individual thermal exchange relation with different ones of the devices;

providing a single flow of subcooled, pressurized refrigerant adequate in refrigeration capacity to meet the demands for refrigeration of the different devices;

branching the subcooled refrigerant into separate heat exchange paths for the different devices; and

individually controlling the temperatures of the different devices by evaporating the refrigerant in the separate branches at different flow rates.

7. The method of removing pressurized thermal control fluid from a selected semiconductor fabrication tool connected by input and output lines to a temperature control unit including a pressurized thermal control fluid source comprising the steps of:

closing off the lines at the temperature control unit;

feeding a gas under pressure into one line in the region of a low point in the lines while coupling a region of the other lines adjacent the tool to the fluid source to drive thermal control fluid from the low point in the first line, the tool and, from a part of the second line into the pressurized thermal control fluid source;

opening the said one line at the temperature control unit;

feeding the gas under pressure into the said other line adjacent the tool to drive the thermal control fluid remaining in the said other line and tool back into the source; and

closing off both lines.

8. The method as set forth in claim 7 above further including the step of refilling the lines and the tool with thermal control fluid including the steps of:

opening both the first and second lines at the control unit;

venting the connected lines to atmosphere near the tool; and

allowing the pressurized thermal control fluid to flow from the source into the lines and the tool.

9. The method as set forth in claim 8 above, further including the steps of:

determining when fluid has been driven back toward the source through the said other line by observing the presence of at least bubbles in the line;

maintaining the pressurized thermal fluid control source at a pressure of 10-25 psi;

pressurizing with a gas pressure of greater than 25 psi; and

continuing the refilling until liquid appears at the venting point.

10. The method of isolating a tool in a cluster tool from a source of heat transfer fluid conducted to and from a control channel by a pair of disconnectable lines, at least one of which is below the tool, comprising the steps of:

providing a source of pressurized heat transfer fluid to the lines;

first purging the heat transfer fluid from a part of the disconnectable lines by driving the fluid under gas pressure from a low region of the lines through the tool and toward the source from a point near the tool;

again purging the heat transfer fluid from a part of the disconnectable lines by driving the fluid under gas pressure from the point near the tool and through a part of the control channel toward the source;

disconnecting the tool from the control channel for appropriate servicing or replacement;

reconnecting the tool to the control channel; and

refilling the control loop from the pressurized reservoir.

11. The method as set forth in claim 10 above, wherein the pressure of the purging gas is higher than the pressure of the reservoir, and further including the steps of venting gas from the interior of the control loop after reconnection, and refilling the interior loop until liquid begins to vent from the system.

12. For separately controlling the temperature of a number of processing tools with a heat exchange fluid, a method comprising the steps of:

providing a flow of pressurized low temperature refrigerant having sufficient refrigeration capacity for the total concurrent needs of the processing tools;

flowing the refrigerant into different branches, one for each tool to be refrigerated;

controlling the refrigerants flows in the different branches in accordance with desired temperatures by lowering the pressure of the refrigerant in each branch to a selected individual level; and

circulating the heat exchange fluid in separate loops in thermal relation to the tools and to the controlled refrigerant flows.

13. A method as set forth in claim 12 above, further including the step of selectively heating heat exchange fluid in selected ones of the heat exchange loops to raise the temperature of the processing tool above the ambient level.