Micropump

• US 6,247,908 B1
• Filed: 03/04/1999
• Issued: 06/19/2001
• Est. Priority Date: 03/05/1998
• Status: Expired due to Term

• Current Assignee: Seiko Instruments Incorporated (Seiko Group)
• Original Assignee: Seiko Instruments Incorporated (Seiko Group)
• Inventors: Furuta, Kazuyoshi, Shinohara, Jun
• Primary Examiner(s): Look, Edward K.
• Assistant Examiner(s): GRAY, MICHAEL KUHN
• Application Number:
  US09/262,436
• Time in Patent Office: 838 Days
• Field of Search: 417/413.2, 417/413.3, 417/479
• US Class Current: 417/413.2
• CPC Class Codes: F04B 43/046 with piezoelectric drive

Abstract

A micropump comprises a first substrate, a pumping section formed in the first substrate, a second substrate connected to the first substrate and having an inlet port and an outlet port, and at least two valve sections formed in the first substrate for controlling the flow of fluid from the inlet port to the outlet port through the pumping section. The pumping section has a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element to control the flow of fluid into and out of the pumping section. Each of the valve sections has a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element. A flow passage is formed in the first substrate for connecting the pumping section and the valve sections in fluid communication. A plurality of packing members are each disposed between a respective diaphragm of the valve sections and the second substrate for blocking the flow of fluid when no voltage is applied to the piezoelectric: elements of the valve sections. The packing members are operative to permit the flow of fluid through the valve sections when a voltage is applied to the piezoelectric elements of the valve sections to cause the diaphragms of the valve sections to undergo deformation and form a gap between each of the packing members and the second substrate or between each of the packing members and a respective diaphragm of the valve sections.

Claims

1. A micropump comprising:

a first substrate;

at least one pumping section formed in the first substrate and having a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element to control the flow of fluid into and out of the pumping section;

a second substrate connected to the first substrate and having an inlet port and an outlet port;

at least two valve sections formed in the first substrate for controlling the flow of fluid from the inlet port to the outlet port through the pumping section, each of the valve sections having a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element;

a flow passage formed in the first substrate for connecting the pumping section and the valve sections in fluid communication; and

a plurality of packing members each disposed between a respective diaphragm of the valve sections and the second substrate for blocking the flow of fluid when no voltage is applied to the piezoelectric elements of the valve sections, the packing members being operative to permit the flow of fluid through the valve sections when a voltage is applied to the piezoelectric elements of the valve sections to cause the diaphragms of the valve sections to undergo deformation and form a gap between each of the packing members and the second substrate or between each of the packing members and a respective diaphragm of the valve sections.

2. A micropump according to claim 1;

wherein the second substrate is connected to the first substrate to form a gap at each of the valve sections; and

wherein each of the packing members is disposed in a respective one of the gaps.

3. A micropump according to claim 1;

wherein each of the diaphragms of the pumping section and the valve sections comprises an etched portion of the first substrate, each of the etched portions having a uniform thickness.

4. A micropump according to claim 1;

wherein each of the diaphragms of the pumping section and the valve sections has a first surface confronting the second substrate and a second surface opposite the first surface; and

wherein each of the piezoelectric elements of the pumping section and the valve sections is disposed on the second surface of the respective diaphragm.

5. A micropump according to claim 4;

wherein the packing members are comprised of a material different from that of the diaphragms of the pumping section and the valve sections.

6. A micropump according to claim 5;

wherein the packing members are comprised of a rubber material having a homogeneous elasticity.

7. A micropump according to claim 1;

wherein the inlet port and the outlet port of the second substrate are disposed directly above a respective one of the packing members.

8. A micropump according to claim 1;

wherein the inlet port and the outlet port of the second substrate are not disposed at portions of the flow passage connecting the pump section and the valve sections.

9. A micropump comprising:

a first substrate;

at least one pumping section formed in the first substrate and having a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element to control the flow of fluid into and out of the pumping section;

a second substrate connected to the first substrate and having an inlet port and an outlet port;

at least two valve sections formed in the first substrate for controlling the flow of fluid from the inlet port to the outlet port through the pumping section, each of the valve sections having a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element;

a flow passage formed in the first substrate for connecting the pumping section and the valve sections in fluid communication; and

a plurality of packing members each disposed on a respective diaphragm of the valve sections for blocking the flow of fluid when no voltage is applied to the piezoelectric elements of the valve sections, the packing members being operative to permit the flow of fluid through the valve sections when a voltage is applied to the piezoelectric elements of the valve sections to cause the diaphragms of the valve sections to undergo deformation and form a gap between each of the packing members and the second substrate.

10. A micropump according to claim 9;

wherein each of the diaphragms of the pumping section and the valve sections comprises an etched portion of the first substrate, each of the etched portions having a uniform thickness.

11. A micropump according to claim 9;

wherein each of the diaphragms of the pumping section and the valve sections has a first surface confronting the second substrate and a second surface opposite the first surface; and

wherein each of the piezoelectric elements of the pumping section and the valve sections is disposed on the second surface of the respective diaphragm.

12. A micropump according to claim 11;

wherein the packing members are comprised of a material different from that of the first substrate that of the diaphragms of the pumping section and the valve sections.

13. A micropump according to claim 9;

wherein the inlet port and the outlet port of the second substrate are disposed directly above a respective one of the packing members.

14. A micropump according to claim 9;

wherein the inlet port and the outlet port of the second substrate are not disposed at portions of the flow passage connecting the pump section and the valve sections.

15. A micropump comprising:

a first substrate;

at least one pumping section formed in the first substrate and having a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element to control the flow of fluid into and out of the pumping section;

a second substrate connected to the first substrate and having an inlet port and an outlet port;

at least two valve sections formed in the first substrate for controlling the flow of fluid from the inlet port to the outlet port through the pumping section, each of the valve sections having a piezoelectric element and a diaphragm for undergoing deformation upon application of a voltage to the piezoelectric element;

a flow passage formed in the first substrate for connecting the pumping section and the valve sections in fluid communication; and

a plurality of packing members each disposed on the second substrate for blocking the flow of fluid when no voltage is applied to the piezoelectric elements of the valve sections, the packing members being operative to permit the flow of fluid through the valve sections when a voltage is applied to the piezoelectric elements of the valve sections to cause the diaphragms of the valve sections to undergo deformation and form a gap between each of the packing members and a respective diaphragm of the valve sections.

16. A micropump according to claim 15;

wherein each of the diaphragms of the pumping section and the valve sections comprises an etched portion of the first substrate, each of the etched portions having a uniform thickness.

17. A micropump according to claim 15;

wherein each of the diaphragms of the pumping section and the valve sections has a first surface confronting the second substrate and a second surface opposite the first surface; and

wherein each of the piezoelectric elements of the pumping section and the valve sections is disposed on the second surface of the respective diaphragm.

18. A micropump according to claim 17;

wherein the packing members are comprised of a material different from that of the first substrate that of the diaphragms of the pumping section and the valve sections.

19. A micropump according to claim 15;

wherein the inlet port and the outlet port of the second substrate are disposed directly above a respective one of the packing members.

20. A micropump according to claim 15;

wherein the inlet port and the outlet port of the second substrate are not disposed at portions of the flow passage connecting the pump section and the valve sections.