Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements

• US 6,248,199 B1
• Filed: 04/26/1999
• Issued: 06/19/2001
• Est. Priority Date: 04/26/1999
• Status: Active Grant

• Current Assignee: Soundcraft Incorporated
• Original Assignee: Soundcraft Incorporated
• Inventors: Smulson, Joel R.
• Primary Examiner(s): Ball, Michael W.
• Assistant Examiner(s): Haran, John T.
• Application Number:
  US09/299,944
• Time in Patent Office: 785 Days
• Field of Search: 156/242, 156/243, 156/244.11, 156/244.12, 156/244.19, 156/150, 156/151, 156/290, 156/293, 156/298, 156/500, 156/552, 257/679, 264/272.11, 264/272.14, 264/272.17, 264/279.1
• US Class Current: 156/244.12
• CPC Class Codes: B29C 48/08 flexible, e.g. films
• CPC Class Codes: B29C 48/157 Coating linked inserts, e.g. chains
• CPC Class Codes: B29L 2017/00 Carriers for sound or information
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2429/00 Carriers for sound or information
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/153 at least one layer is extruded and immediately laminated while in semi-molten state
• CPC Class Codes: B32B 37/206 Laminating a continuous layer between two continuous plastic layers
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: Y10T 156/109 Embedding of laminae within face of additional laminae

Abstract

Cards, labels and the like containing embedded microcircuits or other elements are fabricated in a continuous process by introducing microcircuits between ribbons of extruded material, pressing the ribbons into adhesion with each other while in a plastic state thereby to make a continuous composite sheet containing the microcircuits, cooling the composite sheet to solidify the extrudate material, and cutting out cards from the composite sheet, each card containing a microcircuit. The microcircuits may be introduced between the extruded ribbons on a continuous carrier sheet which may also serve as a printed circuit substrate for the microcircuits. Alternatively, the microcircuits are inserted as discrete units between the extruded ribbons by a suitable robotic device.

Claims

1. A method for the continuous fabrication of electronic access control cards, comprising the steps of:

extruding continuous upper and lower layers of hot extrudate material;

introducing a continuous carrier sheet between said upper and lower layers, said carrier sheet bearing microcircuits at spaced locations therealong;

pressing said upper and lower layers into adhesion with each other while in a plastic state thereby to make a composite sheet of substantially constant thickness having an upper and a lower surface and containing said microcircuits suspended in said extrudate material in spaced relationship to both said upper and said lower surface;

cooling said composite sheet to solidify said hot extrudate material; and

cutting said composite sheet thereby to cut out access control card blanks containing a microcircuit in substantially consistent relative position in each card blank;

characterized in that said carrier sheet is narrower than said composite sheet and has openings between consecutive ones of said microcircuits in said continuous carrier sheet, said openings having a length somewhat shorter than the width of said carrier sheet and a width measured along the length of said web sheet somewhat greater than the spacing between consecutive ones of said card blanks thereby to allow contact between said upper and lower layers for bonding along all edges of said card and to limit the web edge to show only along small portions of card edges for improved esthetic appearance and prevent delamination of the card in use, and additional openings in said carrier sheet to permit bonding of said upper and lower layers to each other at additional locations between said edges of said card.