Method of detecting aberrations of an optical imaging system

• US 6,248,486 B1
• Filed: 09/29/1999
• Issued: 06/19/2001
• Est. Priority Date: 11/23/1998
• Status: Expired due to Fees

• Current Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Dirksen, Peter, Juffermans, Casparus A. H.
• Primary Examiner(s): Young, Christopher G.
• Application Number:
  US09/407,532
• Time in Patent Office: 629 Days
• Field of Search: 430/30, 430/296
• US Class Current: 430/30
• CPC Class Codes: G03F 7/70241 Optical aspects of refractive lens systems, i.e. comprising only refractive elements
• CPC Class Codes: G03F 7/70358 Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
• CPC Class Codes: G03F 7/706 Aberration measurement

Abstract

Aberrations of an imaging system can be detected in an accurate and reliable way by imaging, by means of the imaging system, a circular phase structure on a photoresist, developing the resist and scanning it with a scanning detection device which is coupled to an image processor. The circular phase structure is imaged in a ring structure and each of several possible aberrations, like coma, astigmatism, three-point aberration, etc. causes a specific change in the shape of the inner contour and the outer contour of the ring and/or a change in the distance between these contours, so that the aberrations can be detected independently of each other. The new method may be used for measuring a projection system for a lithographic projection apparatus.

Claims

1. A method of detecting aberrations of an optical imaging system, comprising the steps of

arranging a test object in the object plane of the system;

providing a photoresist layer in the image plane of the system;

imaging the test object by means of the system and an imaging beam;

developing the photoresist layer, and

detecting the developed image by means of a scanning detection device having a resolution which is considerably larger than that of the imaging system,

characterized in that use is made of a test object which comprises at least one closed single figure having a phase structure, and in that the image of this figure observed by the scanning detection device is subjected to an image analysis in order to ascertain at least one of different types of changes of shape in the image of the single figure, each type of shape change being indicative of a given kind of aberration.

2. A method as claimed in claim 1, wherein a scanning electron microscope is used as a scanning detection device.

3. A method as claimed in claim 1, wherein the image analysis method used comprises a Fourier analysis.

4. A method as claimed in claim 1, wherein every single figure is constituted by an area in a plate located at a different height than the rest of said plate.

5. A method as claimed in claim 4, wherein the height difference between the area of the single figure and the rest of the plate is such that a phase difference of 180°

is introduced in the imaging beam.

6. A method as claimed in claim 4, wherein the diameter of the area is proportional to λ

/(NA.M), in which λ

is the wavelength of the imaging beam, NA is the numerical aperture of the imaging system at the image side and M is the magnification of the imaging system.

7. A method as claimed in claim 1, of detecting aberrations of a projection system in a lithographic projection apparatus intended to project a mask pattern, present in a production mask, on a production substrate provided with a photoresist layer, a mask having at least a single figure with a phase structure is arranged at the position of the production mask in the projection apparatus, and in that a photoresist layer with a support is provided at the position of a production substrate.

8. A method as claimed in claim 7, wherein use is made of an empty test mask having at least a single area with a phase structure.