Power module with repositioned positive and reduced inductance and capacitance

• US 6,249,024 B1
• Filed: 12/08/1999
• Issued: 06/19/2001
• Est. Priority Date: 12/09/1998
• Status: Expired due to Term

• Current Assignee: Infineon Technologies Americas Corp. (Infineon Technologies AG), TRW Inc. (Northrop Grumman Corporation)
• Original Assignee: International Rectifier Corporation (Infineon Technologies AG)
• Inventors: Mangtani, Vijay
• Primary Examiner(s): Ngô, Ngân V.
• Application Number:
  US09/456,648
• Time in Patent Office: 559 Days
• Field of Search: 257/341, 257/343, 257/365, 257/401, 257/691, 257/698, 257/724
• US Class Current: 257/341
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A power module includes a three-phase inverter circuit. The positive and negative terminals of the module are centrally located on opposing sides of the module to reduce the length of the current path between the terminals. The reduced current path length significantly reduces the inductance and capacitance of the module.

Claims

1. A power module, comprising:

first through sixth MOS-gated switching transistor dice each having a pair of power terminals and a control terminal;

a substrate;

a first die pad disposed on the substrate and including longitudinally spaced apart opposing ends, one of the power terminals of the first, third and fifth MOS-gated switching transistor dice being coupled to the first die pad;

second, third and fourth die pads disposed on the substrate and longitudinally adjacent the first die pad, one of the power terminals of the second, fourth and sixth MOS-gated transistor dice being coupled to respective ones of the second, fourth and sixth die pads such that they are substantially oppositely disposed from the first, third, and fifth MOS-gated transistor dice, respectively;

a first bonding pad disposed on the substrate and including longitudinally spaced apart opposing ends, the first bonding pad extending substantially adjacent the second, third and fourth die pads, the other of the power terminals of the second, fourth and sixth MOS-gated switching transistor dice being coupled to the first bonding pad;

a positive bus terminal being coupled to the first die pad at a position between the longitudinal ends thereof; and

a negative bus terminal being coupled to the first bonding pad at a position between the longitudinal ends thereof.

2. The power module of claim 1, wherein the MOS-gated switching transistor dice are taken from the group consisting of MOSFET dice and IGBT dice.

3. The power module of claim 1, further comprising:

second, third and fourth bonding pads disposed adjacent the first die pad, the other of the power terminals of the first, third, and fifth MOS-gated switching transistor dice being coupled to the second, third and fourth bonding pads, respectively; and

first, second and third output terminals being coupled to the second, third and fourth bonding pads, respectively.

4. The power module of claim 1, further comprising first through sixth diode dice each including an anode and a cathode and being disposed adjacent to and connected in an anti-parallel configuration with the first through sixth MOS-gated switching transistor dice, respectively.

5. The power module of claim 4, wherein the cathodes of the first, third and fifth diode dice are disposed on the first die pad and the cathodes of the second, fourth and sixth diode dice are disposed on the second, third and fourth die pads, respectively.

6. The power module of claim 5, wherein the second die pad is coupled to the anode of the first diode die and the second bonding pad, the third die pad is coupled to the anode of the third diode die and the third bonding pad, and the fourth die pad is coupled to the anode of the fifth diode die and the fourth bonding pad.

7. The power module of claim 6, wherein the anodes of the second, fourth and sixth diode dice are coupled to the first bonding pad, each having a pair of power terminals and a control terminal;

a substrate;

a first die pad disposed on the substrate and including longitudinally spaced apart opposing ends, one of the power terminals of the first, third and fifth MOS-gated switching transistor dice being coupled to the first die pad;

second, third and fourth die pads disposed on the substrate and longitudinally adjacent the first die pad, one of the power terminals of the second, fourth and sixth MOS-gated transistor dice being coupled to respective ones of the second, fourth and sixth die pads such that they are substantially oppositely disposed from the first, third, and fifth MOS-gated transistor dice, respectively;

a bonding pad disposed on the substrate and including longitudinally spaced apart opposing ends, the bonding pad extending substantially adjacent the second, third and fourth die pads, the other of the power terminals of the second, fourth and sixth MOS-gated switching transistor dice being coupled to the bonding pad;

a positive bus terminal being coupled to the first die pad at a position between the longitudinal ends thereof; and

a negative bus terminal being coupled to the bonding pad at a position between the longitudinal ends thereof.