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Thermally efficient motor controller assembly

  • US 6,249,435 B1
  • Filed: 08/16/1999
  • Issued: 06/19/2001
  • Est. Priority Date: 08/16/1999
  • Status: Expired due to Fees
First Claim
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1. A cooling assembly for semiconductor switches comprising:

  • a heat sink support plate;

    a plurality of semiconductor switch devices mounted on said heat sink support plate;

    a cooling assembly arranged on said heat sink support plate for removing heat away from said heat sink support plate and said semiconductor switch devices; and

    a connector on said semiconductor switch devices for electrically connecting said semiconductor switch devices with an electrical device, said connector including;

    a U-shaped block defining a first sidepiece and an opposing second sidepiece, said first and second sidepieces joined by a bridge, said bridge including a first pair of apertures arranged superjacent a corresponding second pair of apertures within said semiconductor switch devices.

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