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Millimeter wave multilayer assembly

  • US 6,249,439 B1
  • Filed: 10/21/1999
  • Issued: 06/19/2001
  • Est. Priority Date: 10/21/1999
  • Status: Expired due to Term
First Claim
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1. A millimeter wave multilayer assembly, comprising:

  • a multilayer board, comprising;

    a plurality of laminated printed wiring board interconnect layers adjacently disposed, each interconnect layer having a predetermined pattern of interconnect metalization disposed thereon and a plurality of metalized interconnect vias extending therethrough which couple each interconnect metalization of each of said interconnect layers;

    a lower ground layer disposed on the interconnect layers, said lower ground layer having substantially continuous metalization disposed thereon and a plurality of metalized lower ground vias extending therethrough;

    an RF layer disposed on said lower ground layer, said RF layer having a predetermined pattern of microstrip and stripline metalization disposed thereon and a plurality of metalized RF vias extending therethrough;

    an upper ground layer disposed on said RF layer, said upper ground layer having substantially continuous metalization disposed thereon, a plurality of metalized upper ground vias extending therethrough and a stripline to microstrip RF transition area;

    a cavity defined in said upper ground layer, RF layer, lower ground layer and at least one top layer of said interconnect layers; and

    a microwave and millimeter wave integrated circuit (MMIC) chip disposed in said cavity and connected to said interconnect metalization and said microstrip; and

    a frame coupled to said multilayer board, said frame having a waveguide input and a waveguide output, said waveguide input and waveguide output having a ridge probe positioned above said microstrip.

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