Wire bonding method

• US 6,250,534 B1
• Filed: 10/01/1998
• Issued: 06/26/2001
• Est. Priority Date: 10/23/1995
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Shinkawa
• Original Assignee: Kabushiki Kaisha Shinkawa
• Inventors: Sasano, Toshiaki
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US09/164,332
• Time in Patent Office: 999 Days
• Field of Search: 228/102, 228/105, 228/180.22, 228/180.5, 382/145, 382/151
• US Class Current: 228/102
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01066 : Dysprosium [Dy]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]

Abstract

A method and apparatus for wire bonding that allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subsequent registration of the coordinates of bonding points in a bonding point coordinate memory, the coordinates of bonding points and the images of pads or leads obtained by a camera at the time of the registration of the coordinates are both registered in an image data storage memory, so that the registered images are displayed on a monitor in cases where bonding point coordinates are checked or corrected at a later time.

Claims

1. A wire bonding method comprising:

(a) imaging a bonding point with an imaging means;

(b) displaying the image from the imaging means on a display means;

(c) moving vertical marks on said display means to be centered on said bonding point to determine coordinates of the bonding point;

(d) registering the bonding point by storing the image in an image data storage memory in a same order as coordinates of the bonding point are stored in a bonding point coordinate memory;

(e) repeating steps (a)-(d) for each bonding point; and

(f) retrieving a registered image of a bonding point stored in the image data storage memory and the associated bonding point coordinates stored in the bonding point coordinate memory for more easily and accurately checking and correcting the bonding point coordinates.