IC package with quick connect feature

• US 6,250,934 B1
• Filed: 06/23/1998
• Issued: 06/26/2001
• Est. Priority Date: 06/23/1998
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Eskildsen, Steven R., Franz, Jeffrey C., Brannam, David S.
• Primary Examiner(s): PATEL, TULSIDAS C
• Application Number:
  US09/103,241
• Time in Patent Office: 1,099 Days
• Field of Search: 439/71, 439/70, 439/946, 361/736, 361/737, 361/752, 361/753, 361/759, 361/801, 361/802
• US Class Current: 439/71
• CPC Class Codes: H01R 13/22 Contacts for co-operating by abutting
• CPC Class Codes: H01R 13/6273 comprising two latching arms

Abstract

An apparatus and method allowing the leads of an integrated circuit (IC) package to provide the electrical interface between an IC die housed within the IC package and a card connector of an IC card that is to be inserted into a host data processing system. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card connector and the IC package. The IC card connector then provides the electrical interface between the IC card and the data processing system. The present invention eliminates a need for both a printed circuit board (PCB) and the soldering step of coupling the IC package to the PCB.

Claims

1. An integrated circuit (IC) card for use in a data processing device, comprising:

an IC package having multiple leads extending from said IC package;

a casing that encases said IC package; and

a connector contact residing within said casing, said connector contact providing an electrical interface between said IC package and said data processing device, such that if said IC package is inserted into said casing said multiple leads contact said connector contact without use of a printed circuit board, wherein said casing includes an upper surface with an upper opening and a back surface with a back opening, wherein said IC package is inserted into said casing through said back opening, and said connector contact provides electrical interface with said data processing device through said upper opening, and wherein said casing includes at least one stop positioned between said upper surface and said back surface such that said stop allows said IC package to be fully inserted into said casing, and said stop holds said IC package securely within said casing.

2. A casing for an integrated circuit card, comprising:

a housing for encasing an integrated circuit having multiple leads extending from said integrated circuit; and

a connector contact residing within said housing, such that if said casing is inserted into a receptacle of a data processing device said connector contact contacts said multiple leads extending from said integrated circuit and provides an electrical interface between said integrated circuit and said data processing device without use of a printed circuit board,

wherein said housing includes an upper surface with an upper opening and a back surface with a back opening, such that when said integrated circuit is inserted into said housing through said back opening, said connector contact provides electrical interface with said data processing device through said upper opening, and wherein said housing includes at least one stop positioned between said upper surface and said back surface such that said stop allows said IC package to be fully inserted into said casing, and said stop holds said IC package securely within said casing.

3. A method of assembling an integrated circuit (IC) card for use in a data processing device, the method comprising:

providing an IC package having multiple leads extending from said IC package;

providing a casing having a connector contact residing therein, said connector contact providing an electrical interface between said IC package and said data processing device, said providing the casing including;

providing the casing having an upper surface with an upper opening and a back surface with a back opening, and said step of inserting said IC package includes inserting said IC package into said casing through said back opening, and

providing the casing having at least one stop positioned between said upper surface and said back surface such that if said IC package is fully inserted into said casing, said stop holds said IC package securely within said casing; and

inserting said IC package into said casing such that said multiple leads contact said connector contact without use of a printed circuit board.