Method and apparatus for use in assembling electronic devices

• US 6,251,219 B1
• Filed: 09/17/1998
• Issued: 06/26/2001
• Est. Priority Date: 09/17/1998
• Status: Expired due to Fees

• Current Assignee: Intermedics Incorporated
• Original Assignee: Intermedics Incorporated
• Inventors: Chen, Philip H., Gibson, Dennis M., Pham, Cuong Van
• Primary Examiner(s): Ball, Michael W.
• Assistant Examiner(s): WARD, JESSICA LEE
• Application Number:
  US09/160,202
• Time in Patent Office: 1,013 Days
• Field of Search: 297/40, 29D/IG.1, 298/32, 156/299, 156/83, 156/556, 156/560, 156/562, 438/118, 269/13, 269/21
• US Class Current: 156/556
• CPC Class Codes: H01L 21/52 Mounting semiconductor bodies in containers
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 156/1744 Means bringing discrete articles into assembled relationship
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, such as a screen printer, applies adhesive to the backside of each circuit component. The circuit components may then be transferred onto a substrate by the use of a piston transfer device, for instance. Preferably, all the circuit components are transferred substantially simultaneously.

Claims

1. An apparatus for use in assembling an electronic device comprising:

a fixture having a first surface and a second surface, the first surface having a plurality of holders, each of the plurality of holders adapted to accept a circuit component backside up therein such that the backside of the circuit components are in a substantially coplanar relationship, the holders arranged in a pattern corresponding to a pattern of circuit components on a substrate to facilitate simultaneous transfer of the circuit components from the fixture to the substrate, wherein each of the plurality of holders have a respective hole which extends through the second surface; and

a piston slidingly received in each hole adapted for transferring each respective circuit component from the fixture to a substrate.

2. The apparatus, as set forth in claim 1, wherein each hole adapted to supply a vacuum to the respective holder for holding the respective circuit component in the holder.

3. The apparatus, as set forth in claim 1, wherein each of the plurality of holders adapted such that the backside of the circuit component forms a portion of the first surface.

4. The apparatus, as set forth in claim 1, wherein the backside of each circuit component is offset by no more than approximately 0.127 mm (0.005 inches) from the first surface.

5. The apparatus, as set forth in claim 1, wherein the holders are no more than approximately 0.0127 mm (0.0005 inches) larger than the component to be received therein in any linear direction in the plane of the first surface.

6. The apparatus, as set forth in claim 1, wherein each piston has a port adapted to supply a vacuum for holding the respective circuit component.

7. The apparatus, as set forth in claim 1, wherein the fixture is anodized aluminum.

8. The apparatus, as set forth in claim 1, wherein the fixture is conductive plastic.

9. The apparatus, as set forth in claim 1, further comprising a tacky substance in the holders adapted to temporarily hold the circuit component in the respective holder.

10. The apparatus, as set forth in claim 3, further comprising a device adapted to apply adhesive to the backside of each of the circuit components in the fixture.

11. The apparatus, as set forth in claim 10, wherein the device adapted to apply adhesive comprises:

a screen printer having a screen located over the fixture, the screen having a plurality of holes therein, each hole being located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.

12. An apparatus for use in assembling an electronic device comprising:

a fixture having a first surface and a second surface, the first surface is substantially regular and having a plurality of recesses therein, each of the plurality of recesses adapted to accept a circuit component backside up therein such that the backside of the circuit components are in a substantially coplanar relationship, the recesses arranged in a pattern corresponding to a pattern of circuit components on a substrate to facilitate simultaneous transfer of the circuit components from the fixture to the substrate, wherein each of the plurality of recesses have a respective hole which extends through the second surface; and

a plurality of pistons, each piston slidedably located within one of the respective holes, each piston adapted for engaging the respective circuit component in the respective recess and for transferring the respective circuit component from the fixture to the substrate surface.

13. The apparatus, as set forth in claim 12, wherein each piston has a port adapted to supply a vacuum to the respective recess for engaging the respective circuit component.

14. The apparatus, as set forth in claim 12, wherein each hole adapted to supply a vacuum to the respective recess for holding the respective circuit component in the recess.

15. The apparatus, as set forth in claim 12, wherein each of the plurality of recesses adapted such that the backside of the circuit component forms a portion of the first surface.

16. The apparatus, as set forth in claim 12, wherein the backside of each circuit component is offset by no more than approximately 0.127 mm (0.005 inches) from the first surface.

17. The apparatus, as set forth in claim 12, wherein the recesses are no more than approximately 0.0127 mm (0.0005 inches) larger than the component to be received therein in any linear direction in the plane of the first surface.

18. The apparatus, as set forth in claim 12, wherein the fixture is anodized aluminum.

19. The apparatus, as set forth in claim 12, wherein the fixture is conductive plastic.

20. The apparatus, as set forth in claim 12, further comprising a tacky substance in the recesses adapted to temporarily hold the circuit component in the respective recess.

21. The apparatus, as set forth in claim 15, further comprising a device adapted to apply adhesive to the backside of each of the circuit components in the fixture.

22. The apparatus, as set forth in claim 21, wherein the device adapted to apply adhesive comprises:

a screen printer having a screen located over the fixture, the screen having a plurality of holes therein, each hole being located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.