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Magnetron and target producing an extended plasma region in a sputter reactor

  • US 6,251,242 B1
  • Filed: 01/21/2000
  • Issued: 06/26/2001
  • Est. Priority Date: 01/21/2000
  • Status: Expired due to Term
First Claim
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1. A magnetron plasma sputter reactor, comprising:

  • a plasma chamber arranged about a central axis and configured to accommodate a substrate to be sputter coated;

    a target around said central axis and having at least one annular vault disposed on a first side of said target facing said substrate and a well disposed on a back side of said target inside said vault, said vault having an annular inner sidewall, an opposed annular outer sidewall, and a top wall, an aspect ratio of a depth of said vault to a width of said vault being at least 1;

    2, said target being configured to received electrical power to create a plasma within said plasma chamber; and

    magnetic means disposed at least partially in said well to create a magnetic field having magnetic field lines extending from said inner sidewall to said outer sidewall.

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