Method and device for treating two-dimensional substrates, especially silicon slices (wafers), for producing microelectronic components
First Claim
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1. A method for processing flat substrates and silicon wafers for the manufacture of microelectronic components, the method comprising the steps of;
- a) aligning the flat substrates in a substantially vertical plane; and
b) passing the substrates through at least one processing station following step a) by tilting said processing station to at least one of pass and roll the substrates under a force of gravity.
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Abstract
The invention concerns a method and a device for treating and processing flat substrates such as silicon slices (wafers) for producing microelectronic components in vertical alignment.
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27 Claims
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1. A method for processing flat substrates and silicon wafers for the manufacture of microelectronic components, the method comprising the steps of;
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a) aligning the flat substrates in a substantially vertical plane; and
b) passing the substrates through at least one processing station following step a) by tilting said processing station to at least one of pass and roll the substrates under a force of gravity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A device for processing flat substrates and silicon wafers for the manufacture of microelectronic components, the device comprising:
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means for aligning the flat substrates in a substantially vertical plane;
means for passing the substrates through at least one processing station in a vertical aligned orientation; and
means for tilting said processing station to at least one of pass and roll the substrates under a force of gravity. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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Specification