Photosensitive resin composition for rapid prototyping and a process for the manufacture of 3-dimensional objects
First Claim
1. A process for manufacturing a 3-dimensional object comprising:
- applying radiation to an uncured first layer of photosensitive resin composition in order to cure a predetermined area of said first layer, thereafter introducing an uncured second layer of said photosensitive resin composition on top of said first layer and applying radiation to cure a predetermined area of said uncured second layer, wherein said photosensitive resin composition comprises (i) at least one acrylate compound;
(ii) at least one epoxy compound which is solid at room temperature;
(iii) at least one epoxy compound which is liquid at room temperature;
(iv) at least one cationic photoinitiator; and
(v) at least one free radical photoinitiator;
wherein the weight ratio of epoxy compounds to acrylate compounds in said composition is from 0.79 to 1.51.
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Accused Products
Abstract
The invention relates to a photosensitive resin composition for rapid prototyping comprising:
a. about 30 wt. % to about 70 wt. % of at least two epoxy resins, at least one of these resins is solid at room temperature and comprises aromatic groups, and at least one of these resins is liquid, having a viscosity at 25° C. lower than about 1,000 Pa.s,
b. about 15 wt. % to about 50 wt. % of at least one multifunctional acrylate compound
c. about 5 wt. % to about 30 wt. % of a hydroxyfunctional compound
d. about 1 wt. % to about 6 wt. % cationic photoinitiator
e. about 1 wt. % to about 6 wt. % free radical photoinitiator.
The invention further relates to a process for the manufacturing of 3-dimensional objects, known as rapid prototyping, wherein the photosensitive resin composition is used.
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Citations
15 Claims
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1. A process for manufacturing a 3-dimensional object comprising:
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applying radiation to an uncured first layer of photosensitive resin composition in order to cure a predetermined area of said first layer, thereafter introducing an uncured second layer of said photosensitive resin composition on top of said first layer and applying radiation to cure a predetermined area of said uncured second layer, wherein said photosensitive resin composition comprises (i) at least one acrylate compound;
(ii) at least one epoxy compound which is solid at room temperature;
(iii) at least one epoxy compound which is liquid at room temperature;
(iv) at least one cationic photoinitiator; and
(v) at least one free radical photoinitiator;
wherein the weight ratio of epoxy compounds to acrylate compounds in said composition is from 0.79 to 1.51. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification