Optical semiconductor device and optical semiconductor module equipped with the same

• US 6,252,252 B1
• Filed: 04/14/1999
• Issued: 06/26/2001
• Est. Priority Date: 04/16/1998
• Status: Expired due to Term

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Kunii, Hideo, Take, Toshiyuki, Seyama, Hiroki, Sekiguchi, Satoru, Ishikawa, Tsutomu, Kobori, Hiroshi, Arai, Masashi, Inoguchi, Hiroshi, Takada, Kiyoshi
• Primary Examiner(s): Lee, Eddie C.
• Assistant Examiner(s): Wilson, Allan R.
• Application Number:
  US09/291,202
• Time in Patent Office: 804 Days
• Field of Search: 257/80-82, 257/433, 257/434, 257/436, 438/116
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A mold 25 for molding semiconductor chips 23 and 24 serving as a light emitting element and a light receiving element, respectively, is made of a material capable of transmitting light. A groove 27 is formed on the region where light is emitted from and incident on the semiconductor chips so that it constitutes a reflecting face. Thus, the light is emitted and incident through the side E of the mold. In this configuration, the outer size of the light receiving element or light emitting element can be minimized, and the module provided with these semiconductor chips can also be miniaturized.

Claims

1. An optical semiconductor device comprising:

a semiconductor chip having a light emitting face or a light receiving face; and

a resin mold package for embedding said semiconductor chip, having a reflecting face arranged to form a constant angle with said light emitting face or light receiving face, wherein

an optical path of light directly exiting from the resin package or being incident directly on the resin package is bent through said reflecting face.

2. An optical semiconductor device according to claim 1,

wherein said semiconductor chip is a chip having the light receiving face,

said resin mold package has the reflecting face arranged to cross a perpendicular line of the light receiving face at a constant angle, and

said optical path is formed so that the light incident from a side of said resin mold package is bent by said reflecting face and incident on said light receiving face.

3. An optical semiconductor device according to claim 1,

wherein said semiconductor chip is a chip having the light emitting face,

said resin mold package has the reflecting face arranged to cross a perpendicular line of the light emitting face at a constant angle, and

said optical path is formed to exit at the constant angle with respect to a light emitting direction through said reflecting face.

4. An optical semiconductor device according to claim 3,

wherein said semiconductor chip is connected to a lead extended from a first side of said resin mold package, and the light emitted from the semiconductor chip is caused to exit through said reflecting face from a second side of said resin mold package opposite to said first side.

5. An optical semiconductor device according to claim 3,

wherein said semiconductor chip is a chip having the light emitting face on its side, and

the light emitted from said semiconductor chip is caused to emit through the reflecting face from an upper face of said resin mold package.

6. An optical semiconductor device according to claim 3,

wherein said resin mold package is made of resin capable of transmitting at least said light, and a face formed in the resin mold package itself constitutes said reflecting face.

7. An optical semiconductor device according to claim 6,

wherein said reflecting face is a slope of a groove formed in said resin mold package.

8. An optical semiconductor device according to claim 1,

wherein said resin mold package is made of a hollow package of a first material not constituting the optical path,

said package is provided in its opening with means made of a second material capable of transmitting at least said light and constituting the optical path, and

a face formed in said means itself constitutes said reflecting face.

9. An optical semiconductor device according to claim 8,

wherein said first material is ceramic or metal, and said second material is glass or resin capable of transmitting at least said light.

10. An optical semiconductor device according to claim 9,

wherein said reflecting face is a slope of a groove formed in said second material.

11. An optical semiconductor device according to claim 1, further comprising:

a lead frame having an island on which said semiconductor is placed; and

a lead electrically connected to said semiconductor chip and extended externally from said resin mold package, said lead being extended from a side opposite to a side on which light is incident.

12. An optical semiconductor device according to claim 1, wherein said semiconductor chip has an upper face serving as the light receiving face, and

said resin mold package is made of resin capable of transmitting at least said light, and has the reflecting face arranged to cross a perpendicular line of the light receiving face at a constant angle, and a convex lens provided integrally to a side of said resin mold package.

13. An optical semiconductor device according to claim 12,

wherein said resin mold package is provided with a lead whose upper face is flush with an extreme end of said convex lens.

14. An optical semiconductor device according to claim 1, wherein the optical path is bent through an outer surface of the resin mold package.