Array substrate, liquid crystal display device and their manufacturing method

• US 6,252,297 B1
• Filed: 05/08/2000
• Issued: 06/26/2001
• Est. Priority Date: 03/07/1997
• Status: Expired due to Term

• Current Assignee: Japan Display Central Incorporated (Japan Display Incorporated)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kemmochi, Masato, Shoji, Masato
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US09/566,808
• Time in Patent Office: 414 Days
• Field of Search: 257/59, 257/72, 257/350, 257/640, 257/642, 257/643
• US Class Current: 257/640
• CPC Class Codes: G02F 1/136227 Through-hole connection of the pixel electrode to the active element through an insulation layer
• CPC Class Codes: H01L 21/02118 carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC polymers per se C08G, photoresist per se G03F
• CPC Class Codes: H01L 21/312 Organic layers, e.g. photoresist H01L21/3105, H01L21/32 take precedence; photoresists per se G03C
• CPC Class Codes: H01L 21/76804 by forming tapered via holes

Abstract

An array substrate typically used in a liquid crystal display device includes inter-layer insulating films thick enough to prevent step-off breakage of conductive layers at contact holes while promising a reliability. Thick inter-layer insulating films are made by stacking a film made of an inorganic material, such as silicon nitride or silicon oxide, having a low moisture permeability and thereby promising a reliability of the liquid crystal display device, and a film made of an organic material, such as acrylic resin, that can be readily stacked thick so that the inner wall of the contact hole is gently sloped with respect to the substrate surface to thereby prevent step-off breakage of a conductive layer as thin as 100 nm or less.

Claims

1. An array substrate comprising:

a base substrate;

a semiconductor layer formed on said base substrate;

a first conductive layer disposed on said semiconductor layer;

a first inter-layer insulating film made of an inorganic material over said semiconductor layer;

a second inter-layer insulating layer made of an organic material on said first conductive layer and said first inter-layer insulating film; and

a second conductive layer formed on said second inter-layer insulating film,

said second inter-layer insulating film has a hole extending therethrough to a top surface of said first conductive layer,

said hole having a tapered inner wall surface,

said organic material of said second inter-layer insulating film fully covering said first inter-layer insulating film at the inner wall surface of said hole, and

said second conductive layer being connected to said first conductive layer via said hole.

2. An array substrate comprising:

a base substrate;

a semiconductor layer formed on said base substrate;

a first conductive layer disposed on said semiconductor layer;

a first inter-layer insulating film made of an inorganic material over said semiconductor layer and having a first hole extending therethrough to a top surface of said first conductive layer;

a second inter-layer insulating layer made of an organic material on said first inter-layer insulating film and having a second hole extending therethrough to said the top surface of said first conductive layer via said first hole; and

a second conductive layer formed on said second inter-layer insulating film and connected to said first conductive layer via said second hole,

said second hole in said second inter-layer insulating film being made smaller than said first hole,

said organic material of said second inter-layer insulating film completely covering an inner wall surface of said first hole and extending to the top surface of said first conductive layer, thereby said first inter-layer insulating film does not appear at the inner wall surface of said second hole, and

at least one of said first conductive layer and said first inter-layer insulating film being interposed between said second inter-layer insulating film and said semiconductor layer.

3. The array substrate according to claim 2 wherein said inner wall surface of said second hole is tapered relative to a major surface of said base substrate.

4. The array substrate according to claim 3 wherein the shape of said second hole is circular, rectangular or polygonal.

5. The array substrate according to claim 3 wherein the tangential line of the steepest portion of the inner wall surface of said second hole makes an angle smaller than 70 degrees relative to the major surface of said base substrate.

6. The array substrate according to claim 2 wherein said second hole has an opening end forming a curved plane.

7. The array substrate according to claim 6 wherein said curved plane has a radius of curvature larger than 1×

10<sup>−

8</sup> m and smaller than radium 1×

10<sup>−

4</sup> m.

8. The array substrate according to claim 2 wherein, said semiconductor layer being formed in a pattern of a plurality of islands each forming each switching element, said first conductive layer being an output electrode connected to each said semiconductor layer, said inorganic material mainly containing silicon nitride or silicon oxide, said organic material mainly containing an acrylic resin or polyimide, and said second conductive layer being pixel electrode.

9. A liquid crystal display device including an array substrate on which a plurality of switching elements and pixel electrodes are formed, an opposite substrate disposed in confrontation with said array substrate, and a liquid crystal layer held between said array substrate and said opposite substrate, said array substrate comprising:

a base substrate;

a semiconductor layer formed on said base substrate;

a first conductive layer disposed on said semiconductor layer;

a first inter-layer insulating film made of an inorganic material over said semiconductor layer;

a second inter-layer insulating layer made of an organic material on said first conductive layer and said first inter-layer insulating film; and

a second conductive layer formed on said second inter-layer insulating film,

said second inter-layer insulating film has a hole extending therethrough to a top surface of said first conductive layer,

said hole having a tapered inner wall surface,

said organic material of said second inter-layer insulating film fully covering said first inter-layer insulating film at the inner wall surface of said hole, and

said second conductive layer being connected to said first conductive layer via said hole.

10. A liquid crystal display device including an array substrate on which a plurality of switching elements and pixel electrodes are formed, an opposite substrate disposed in confrontation with said array substrate, and a liquid crystal layer held between said array substrate and said opposite substrate, said array substrate comprising:

a base substrate;

a semiconductor layer formed on said base substrate;

a first conductive layer disposed on said semiconductor layer;

a first inter-layer insulating film made of an inorganic material over said semiconductor layer and having a first hole extending therethrough to a top surface of said first conductive layer;

a second inter-layer insulating layer made of an organic material on said first inter-layer insulating film and having a second hole extending therethrough to said the top surface of said first conductive layer via said first hole; and

a second conductive layer formed on said second inter-layer insulating film and connected to said first conductive layer via said second hole,

said second hole in said second inter-layer insulating film being smaller than said first hole,

said organic material of said second inter-layer insulating film completely covering an inner wall surface of said first hole and extending to the top surface of said first conductive layer, thereby said first inter-layer insulating film does not appear at the inner wall surface of said second hole, and

at least one of said first conductive layer and said first inter-layer insulating film being interposed between said second inter-layer insulating film and said semiconductor layer.

11. The liquid crystal display device according to claim 10 wherein said inner wall surface of said second hole is tapered relative to a major surface of said base substrate.

12. The liquid crystal display device according to claim 11 wherein the shape of said second hole is circular, rectangular or polygonal.

13. The liquid crystal display device according to claim 11 wherein the tangential line of the steepest portion of the inner wall surface of said second hole makes an angle smaller than 70 degrees relative to the major surface of said base substrate.

14. The liquid crystal display device according to claim 10 wherein said second hole has an opening end forming a curved plane.

15. The liquid crystal display device according to claim 14 wherein said curved plane has a radius of curvature larger than 1×

10<sup>−

8</sup> m and smaller than radium 1×

10<sup>−

4</sup> m.

16. The liquid crystal display device according to claim 10 wherein said semiconductor layer is formed in a pattern of a plurality of islands each forming each said switching element, said first conductive layer being an output electrode connected to each said semiconductor layer of a plurality of islands, said inorganic material mainly containing silicon nitride or silicon oxide, said organic material mainly containing an acrylic resin or polymide, and said second conductive layer being said pixel electrode.

17. An array substrate comprising:

a base substrate;

a semiconductor layer formed on said base substrate;

a first conductive layer disposed on said semiconductor layer;

a first inter-layer insulating film made of an inorganic material over said semiconductor layer and said first conductive layer and having a first hole extending therethrough to a top surface of said first conductive layer;

a second inter-layer insulating layer made of an organic material on said first inter-layer insulating film and having a second hole disposed in said first hole, thereby said second hole extends therethrough to said the top surface of said first conductive layer via said first hole; and

a second conductive layer formed on said second inter-layer insulating film and connected to said first conductive layer via said second hole,

wherein said organic material of said second inter-layer insulating film completely covers an inner wall surface of said first hole and extending to the top surface of said first conductive layer, and

at least one of said first conductive layer and said first inter-layer insulating film is interposed between said second inter-layer insulating film and semiconductor layer.