Wireless LAN antenna with single loop

• US 6,252,561 B1
• Filed: 08/02/1999
• Issued: 06/26/2001
• Est. Priority Date: 08/02/1999
• Status: Expired due to Term

• Current Assignee: Accton Technology Corporation
• Original Assignee: Accton Technology Corporation
• Inventors: Hsiao, Ji-Hong, Lin, Wen-Hsiung, Wu, Kun-Fang, Wu, Ming-Hsiu
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): TRAN, CHUC
• Application Number:
  US09/365,974
• Time in Patent Office: 694 Days
• Field of Search: 343/702, 343/866, 343/700.MS, 343/846, 343/848, 343/718, 343/752, 343/741, 343/895, 343/859, 343/872, 343/894, 343/713, 343/727, 343/853
• US Class Current: 343/866
• CPC Class Codes: H01Q 1/007 specially adapted for indoor communication
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A wireless LAN antenna comprises a dielectric substrate having a first surface and a second surface. The first surface of the dielectric substrate has a rectangular loop. A rectangular grounding copper foil is adhered within the rectangular loop. A signal feeding copper foil is further included. One end of the signal feeding copper foil is connected to the rectangular loop and the grounding copper foil, while another end of the signal feeding copper foil running across another end of the rectangular loop. Moreover, a layer of back surface copper foil is plated to the back side of the printed circuit board. This back surface copper foil covers one half of the loop on the front surface. Adjustment of the transversal dimensions of the grounding copper foil will impedance-match the antenna to the feeding structure of the antenna.

Claims

1. An antenna comprising:

a dielectric substrate having a front surface side and a back surface side;

a rectangular closed-loop element laid out on said front surface side of said dielectric substrate;

a layer of rectangular grounding element formed on said front surface side of said dielectric substrate and circumscribed by said rectangular closed-loop element, said layer of rectangular grounding element having a vertical rectangular protrusion portion at the bottom center thereof and across said rectangular closed-loop element;

a signal feeding line having one end connected to a top portion of said layer of rectangular grounding element and the other end connected to a bottom portion of said vertical rectangular protrusion portion; and

a layer of copper foil plated on said back surface side of said dielectric substrate and covering a left/right half portion of said front surface side of said dielectric substrate for generating phase differences between currents from two half portions of said rectangular closed-loop element.

2. The antenna as claimed in claim 1, wherein said phase differences generated by said layer of copper foil enhance radiation effects.

3. The antenna as claimed in claim 1, wherein said rectangular grounding element adjusts the impedance matching between said rectangular closed-loop element and said signal feeding line by controlling the distance between said rectangular closed-loop element and said layer of rectangular grounding element.

4. The antenna as claimed in claim 1, wherein the size of said rectangular closed-loop element is about 7.2 mm by 42.3 mm.

5. The antenna as claimed in claim 1, wherein the size of said layer of rectangular grounding element is about 2.4 mm by 36 mm.

6. The antenna as claimed in claim 1, wherein said layer of rectangular grounding element is made of copper foil.

7. The antenna as claimed in claim 1, wherein said signal feeding line is made of copper foil.