Removable remote control amplifier

• US 6,252,771 B1
• Filed: 01/06/1999
• Issued: 06/26/2001
• Est. Priority Date: 01/06/1999
• Status: Expired due to Fees

• Current Assignee: Southern Audio Services Incorporated
• Original Assignee: Southern Audio Services Incorporated
• Inventors: Jordan, Jeff B.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/226,373
• Time in Patent Office: 902 Days
• Field of Search: 361/686-690, 361/699-704, 361/707, 361/709, 361/710, 361/713, 361/719, 361/720, 257/714-719, 174/15.1, 174/15.2, 174/16.3, 165/80.4, 330/66, 330/207.P
• US Class Current: 361/704
• CPC Class Codes: H01L 2023/405 heatsink to package
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

An amplifier having removable remote controls and the ability to easily couple with other amplifiers for easy mounting is disclosed. The amplifier includes removable remote controls and isocoupling systems that connect two or more amplifiers and that electrically insulate the mounting screws from the mounting surface. The amplifier may also be liquid cooled to dissipate heat generated by the amplifier.

Claims

1. An amplifier having a heat sink, a circuit board affixed to the heat sink, audio output adjustment devices affixed to the circuit board, and controls for adjustment of the audio output from the devices, the improvement to which comprises:

a control pod housing said controls, said control pod being physically attachable to said circuit board to permit said controls to adjust said devices and being remotely positionable relative to said amplifier while maintaining communication with said circuit board to permit said controls to adjust said devices.

2. The amplifier according to claim 1 further comprising a mounting member used to mount said amplifier to a surface, and an isocoupling, said isocoupling constructed to electrically isolate said mounting member from said amplifier.

3. The amplifier according to claim 2 wherein said isocoupling is sized and shaped and constructed from material to electrically isolate a second mounting member used to mount a second amplifier to a second surface and to couple said amplifier said second amplifier.

4. The amplifier according to claim 1 wherein said amplifier further comprises a heat sink having one or more walls forming at least one isocoupling bore extending from a surface of said heat sink and into said heat sink.

5. The amplifier according to claim 4 further comprising an isocoupling, said isocoupling sized and shaped to fit within said isocoupling bore, said isocoupling comprising:

a first end section sized and shaped to be positionable within said isocoupling bore, said first end section having a first aperture extending through opposite sides of said first end section; and

a second end section sized and shaped to be extendable from said isocoupling bore and extendable into an isocoupling bore of a second amplifier to permit coupling of said amplifier to said second amplifier;

said second end section having a second aperture extending through opposite sides of said second section.

6. The amplifier according to claim 5 wherein said walls forming said isocoupling bore have two aligned mounting member apertures defining a passageway through said walls and said isocoupling bore that is alignable with the first end section aperture when extended into said isocoupling bore.

7. The amplifier according to claim 6 further comprising:

a least one heat generating device;

a heat sink in thermal communication with said heat generating device, said heat sink configured to have at least one cooling channel extending therethrough, said cooling channel attachable to a source of coolant.

8. The amplifier according to claim 7 wherein said cooling channel is offset from said circuit board.

9. The amplifier according to claim 7 wherein said cooling channel is offset from said control pod receptacle.

10. An amplifier comprising:

a circuit board having one or more controls operatively connected thereto,

a heat sink in thermal communication with said circuit board, said heat sink having at least one wall forming at least one isocoupling bore extending from a surface of said heat sink and into said heat sink,

a mounting member constructed to mount said amplifier to a surface, and

an isocoupling sized and shaped to fit within said bore and positionable to electrically isolate said mounting member from said amplifier.

11. The amplifier according to claim 10 wherein said isocoupling is sized and shaped and constructed from material to electically isolate a second mounting member used to mount a second amplifier to a second surface and to couple said amplifier to said second amplifier.

12. The amplifier according to claim 10 wherein said isocoupling comprising:

a first end section sized and shaped to be positionable within said isocoupling bore, said first end section having a first aperture extending through opposite sides of said first end section; and

a second end section sized and shaped to be extendable from said isocoupling bore and extendable into an isocoupling bore of a second amplifier to permit coupling of said amplifier to said second amplifier;

said second end section having a second aperature extending through opposite sides of said second section.

13. The amplifier according to claim 12 wherein said walls forming said isocoupling bore have two aligned mounting member aperatures defining a passageway through said walls and said isocoupling bore that is alignable with the first end section aperature extended into said isocoupling bore.

14. The amplifier according to claim 13 further comprising audio output adjustment devices affixed to said circuit board, controls for adjustment of the audio output from said devices, and a control pod housing said controls, said control pod being physically attachable and detachable to said circuit board to permit said controls to adjust said devices when attached or detached.

15. The amplifier according to claim 14 further comprising at least one heat generating device in thermal communication with said circuit board and said heat sink, said heat sink configured to have at least one cooling channel extending therethrough, said cooling channel attachable to a source of coolant.

16. The amplifier according to claim 15 wherein said cooling channel is offset from said circuit board.

17. The amplifier according to claim 15 wherein said cooling channel is offset from said control pod receptacle.

25. The amplifier according to claim 16 wherein said cooling channel is offset from said circuit board.

18. In an amplifier having a heat sink, a circuit board affixed to the heat sink, audio output adjustment devices affixed to the circuit board, and controls for adjustment of the audio output from the devices, the improvement to which comprises:

said heat sink configured to have parallel cooling channels, each extending from one end of said heat sink to an opposite end of said heat sink,

a first hollow coupling tube having sealing members affixed to opposite end sections of said first tube, each of said opposite end sections sized to extend into at least one end of one of said parallel cooling channels to permit coolant flowing through one of said parallel cooling channels to flow to other of said parallel cooling channels,

a second hollow coupling tube having sealing members affixed to at least one end section of said second tube, said one end section of said second tube sized to extend into that end of said one of said parallel cooling channels into which coolant is to flow, said second tube attachable to a source of coolant, and

a third hollow coupling tube having sealing members affixed to at least one end section of said third tube, said one end section of said third tube sized to extend into that end of said one of said parallel cooling channels from which coolant is to flow.

19. The amplifier according to claim 18 wherein said heat sink is configured to have one or more walls forming at least one isocoupling bore extending from a surface of said heat sink and into said heat sink.

20. The amplifier according to claim 19 further comprising a control pod removably attached to said circuit board, said control pod remotely positionable relative to said amplifier, said control pod maintaining communication with said circuit board when remotely positioned from said amplifier, said control pod housing at least one of said one or more controls.

21. The amplifier according to claim 20 further comprising an isocoupling, said isocoupling configured to electrically isolate said amplifier from a surface onto which said amplifier is mounted.

22. The amplifier according to claim 21 wherein said isocoupling is sized and shaped and constructed from material to electrically isolate a second mounting member used to mount a second amplifier to a second surface and to couple said amplifier to said second amplifier.

23. The amplifier according to claim 20 further comprising an isocoupling, said isocoupling sized and shaped to fit within said isocoupling bore, said isocoupling comprising:

a first end sized and shaped to be positionable within said isocoupling bore, said first end section having a first aperture extending through opposite sides of said first end section; and

a second end section sized and shaped to be extendable from said isocoupling bore and extendable into an isocoupling bore of a second amplifier to permit coupling of said amplifier to said second amplifier;

said second end section having a second aperature extending through opposite sides of said second section.

24. The amplifier according to claim 23 wherein said walls forming said isocoupling bore have two aligned mounting member aperatures defining a passageway through said walls and said isocoupling bore that is alignable with the first end section aperature when extended into said isocoupling bore.

26. The amplifier according to claim 18 wherein said cooling channel is offset from said control pod receptacle.

27. A method for coupling a first and second amplifier, each having a heat sink having one or more walls forming at least one isocoupling bore extending from a surface of said heat sink and into said heat sink, said walls having two aligned mounting member aperatures defining a passageway through said walls and said isocoupling bore, said method comprising the steps of:

(a) inserting an isocoupling sized and shaped to fit within said isocoupling bore of said first amplifier, said isocoupling comprising;

(i) a first end section sized and shaped to be positionable within said isocoupling bore of said first amplifier, said first end section having a first aperture extending through opposite sides of said first end section and positioned to be alignable with said two mounting member aperatures of said isocoupling bore of said first amplifier, and

(ii) a second end section sized and shaped to extendable from said isocoupling bore of said first amplifier and into said isocoupling bore of said second amplifier, said second end section having a second aperature extending through opposite sides of said second section and positioned to be alignable with said two mounting member aperatures of said isocoupling bore of said second amplifier;

until said first aperture aligns with said two mounting member aperatures of said first amplifier;

(b) inserting a mounting member through said first aperture and said two mounting member apertures of said first amplifier and manipulating said mounting member to fixedly position said first amplifier in a desired position;

(c) inserting said second end section of said isocoupling into said isocoupling bore of said second amplifier until said second aperture aligns with said two mounting member apertures in said second amplifier;

(d) inserting a second mounting member through said second aperture aperture and said two mounting member apertures of said second amplifier and manipulating said second mounting member to fixedly position said second amplifier in its desired position.

28. The method according to claim 27 wherein said first and second amplifiers further comprise a circuit board having a least one heat generating device attached thereto;

a heat sink in thermal communication with said heat generating device, said heat sink configured to have at least one cooling channel extending therethrough, said cooling channel attachable to a source of coolant, said method further comprising the steps of;

(a) connecting said cooling channel to a source of coolant;

(b) operating said amplifier(s);

(c) circulating a coolant through said cooling channels.

29. The method according to claim 27 wherein said one or more amplifiers form a first cooling channel and a second cooling channel, said method further comprising the steps of:

(a) operatively connecting said first cooling channel to said second cooling channel;

(b) operatively connecting said first cooling channel and said second cooling channel to said source of coolant.