Heat sink attachment apparatus and method

• US 6,252,773 B1
• Filed: 04/23/1999
• Issued: 06/26/2001
• Est. Priority Date: 04/23/1999
• Status: Expired due to Fees

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Werner, Paul L.
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US09/298,427
• Time in Patent Office: 795 Days
• Field of Search: 165/80.2, 165/80.3, 165/185, 174/163, 257/706-707, 257/712-713, 257/718-719, 257/726-727, 360/690, 360/704, 360/707, 360/709-710, 360/717-722, 360/807-810
• US Class Current: 361/704
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention provides a heat transfer device for cooling an electronic component mounted to a substrate. The present invention also provides for a method to cool electronic components by using the heat transfer device and a method to manufacture the heat transfer device. In one embodiment, the heat transfer device comprises an elongated body having opposing first and second major surfaces and opposing first and second minor surfaces; a mounting recess extending along a length of the second minor surface; a first ledge extending from the first major surface and defining a first component mounting area of a first lateral dimension; and a second ledge extending from the second major surface and defining a second component mounting area of a second lateral dimension, the second dimension differing from the first dimension.

Claims

1. For use in cooling an electronic component mounted to a substrate, a heat transfer device, comprising:

an elongated body having opposing first and second major surfaces and opposing first and second minor surfaces, a mounting recess extending along the longitudinal length of said second minor surface; and

a first ledge extending from said first major surface and defining a first component mounting area of a first lateral dimension; and

a second ledge extending from said second major surface and defining a second component mounting area of a second lateral dimension, said second dimension differing from said first dimension.

2. The device as recited in claim 1 wherein said mounting recess is a cooling channel.

3. The device as recited in claim 1 wherein a channel extends along the length of said first minor surface, said channel constituting a receptacle for a spring clip to secure components to said device.

4. The device as recited in claim 1 wherein a first auxiliary ledge extends from said first major surface, said first auxiliary ledge paralleling said first ledge and defining a receptacle for a spring clip to secure components to said device.

5. The device as recited in claim 1 wherein a second auxiliary ledge extends from said second major surface, said second auxiliary ledge paralleling said second ledge and defining a receptacle for a spring clip to secure components to said device.

6. The device as recited in claim 1 wherein pins are press fit in said mounting recess to mount said device on a substrate by press fitting said pins in holes on said substrate.

7. The device as recited in claim 4 wherein a heat sink is releasably fastened to said first auxiliary ledge.

8. The device as recited in claim 5 wherein a heat sink is releasably fastened to said second auxiliary ledge.

9. An electronic circuit comprising:

two or more heat generating electronic components;

a substrate;

a heat transfer device for use in cooling said two or more heat generating electronic components mounted to said substrate, including;

an elongated body having opposing first and second major surfaces and opposing first and second minor surfaces, a mounting recess extending along the longitudinal length of said second minor surface;

a first ledge extending from said first major surface and defining a first component mounting area of a first lateral dimension; and

a second ledge extending from said second major surface and defining a second component mounting area of a second lateral dimension, said second dimension differing from said first dimension.

10. The device as recited in claim 9 wherein said mounting recess is a cooling channel.

11. The device as recited in claim 9 wherein a channel extends along the length of said first minor surface, said channel constituting a receptacle for a spring clip to secure components to said device.

12. The device as recited in claim 9 wherein a first auxiliary ledge extends from said first major surface, said first auxiliary ledge paralleling said first ledge and defining a receptacle for a spring clip to secure components to said device.

13. The device as recited in claim 9 wherein a second auxiliary ledge extends from said second major surface, said second auxiliary ledge paralleling said second ledge and defining a receptacle for a spring clip to secure components to said device.

14. The device as recited in claim 9 wherein pins are press fit in said mounting recess to mount said device on said substrate by press fitting said pins in holes on said substrate.

15. The device as recited in claim 12 wherein a heat sink is releasably fastened to said first auxiliary ledge.

16. The device as recited in claim 13 wherein a heat sink is releasably fastened to said second auxiliary ledge.

17. A method for cooling an electronic component mounted to a substrate, comprising:

fastening a heat transfer device to said substrate, said heat transfer device including;

an elongated body having opposing first and second major surfaces and opposing first and second minor surfaces, a mounting recess extending along the longitudinal length of said second minor surface;

a first ledge extending from said first major surface and defining a first component mounting area of a first lateral dimension; and

a second ledge extending from said second major surface and defining a second component mounting area of a second lateral dimension, said second dimension differing from said first dimension.

18. The method as recited in claim 17 wherein said mounting recess is a cooling channel.

19. The method as recited in claim 17 wherein a channel extends along the length of said first minor surface, said channel constituting a receptacle for a spring clip to secure components to said device.

20. The method as recited in claim 17 wherein a first auxiliary ledge extends from said first major surface, said first auxiliary ledge paralleling said first ledge and defining a receptacle for a spring clip to secure components to said device.

21. The method as recited in claim 17 wherein a second auxiliary ledge extends from said second major surface, said second auxiliary ledge paralleling said second ledge and defining a receptacle for a spring clip to secure components to said device.

22. The method as recited in claim 17 wherein pins are press fit in said mounting recess to mount said device on said substrate by press fitting said pins in holes on said substrate.

23. The method as recited in claim 20 wherein a heat sink is releasably fastened to said first auxiliary ledge.

24. The device as recited in claim 21 wherein a heat sink is releasably fastened to said second auxiliary ledge.

25. A method for manufacturing a heat transfer device for cooling an electronic component mounted to a substrate, comprising:

forming an extrusion having;

an elongated body;

opposing first and second major surfaces and opposing first and second minor surfaces, with a mounting recess extending along the longitudinal length of said second minor surface;

a first ledge extending from said first major surface and defining a first component mounting area of a first lateral dimension;

a second ledge extending from said second major surface and defining a second component mounting area of a second lateral dimension, said second dimension differing from said first dimension; and

cutting said extrusion to a predetermined length.

26. The method as recited in claim 25 wherein said mounting recess is a cooling channel.

27. The method as recited in claim 25 wherein a channel is formed along the length of said first minor surface, said channel constituting a receptacle for a spring clip to secure components to said device.

28. The method as recited in claim 25 wherein a first auxiliary ledge is formed to extend from said first major surface, said first auxiliary ledge paralleling said first ledge and defining a receptacle for a spring clip to secure components to said device.

29. The method as recited in claim 25 wherein a second auxiliary ledge is formed to extend from said second major surface, said second auxiliary ledge paralleling said second ledge and defining a receptacle for a spring clip to secure components to said device.