Micro-void detection

• US 6,253,621 B1
• Filed: 08/31/1999
• Issued: 07/03/2001
• Est. Priority Date: 08/31/1999
• Status: Expired due to Fees

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices SDN Berhad (Advanced Micro Devices, Inc.)
• Inventors: Jarvis, Richard W.
• Primary Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US09/387,182
• Time in Patent Office: 672 Days
• Field of Search: 736/43, 736/55, 736/57
• US Class Current: 73/655
• CPC Class Codes: G01N 2291/0231 Composite or layered materials
• CPC Class Codes: G01N 2291/101 one transducer
• CPC Class Codes: G01N 29/07 by measuring propagation velocity or propagation time of acoustic waves
• CPC Class Codes: G01N 29/2418 using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics photoacoustic cells G01N21/1702; measuring characteristics of vibrations by using radiation-sensitive means G01H9/00; acousto-optical conversion techniques for short-range imaging G01S15/8965; sound-producing devices using laser bundle G10K15/046

Abstract

According to an example embodiment of the present invention, a semiconductor device having conductive structure is analyzed using acoustic energy. Acoustic energy is generated in the device, and a resulting acoustic wave is detected. Using the detected wave, an index of refraction of a portion of the conductive structure is determined as a function of the wave. The calculated index of refraction is used and at least one defect in the conductive structure is detected. Using this method, defects can be detected during or after the manufacture of semiconductor devices in a cost effective, reliable manner. This method is particularly useful for defects that are not detectable using typical optical scanning methods due to opaque material in semiconductor devices.

Claims

1. A method for analyzing a semiconductor device having conductive structure, the method comprising:

generating acoustic energy in the device;

detecting an acoustic wave;

calculating an index of refraction of a portion of the conductive structure as a function of the wave; and

using the calculated index of refraction and detecting at least one defect in the conductive structure.

2. A method for analyzing a semiconductor device, according to claim 1, wherein using the calculated index of refraction to detect at least one defect in the conductive structure comprises:

comparing the calculated index of refraction to a standard index of refraction defined as a function of the semiconductor device and the generated acoustic energy; and

detecting at least one defect by observing differences between the calculated and standard indices of refraction.

3. A method for analyzing a semiconductor device, according to claim 2, wherein the standard index of refraction is determined by analyzing the semiconductor device under analysis.

4. A method for analyzing a semiconductor device, according to claim 2, wherein the standard index of refraction is determined by analyzing a non-defective semiconductor device.

5. A method for analyzing a semiconductor device, according to claim 1, wherein the calculated index of refraction is relative to the density of the portion of the conductive structure.

6. A method for analyzing a semiconductor device, according to claim 5, wherein variations in density cause variations in the calculated index of refraction, and wherein the at least one defect in the conductive structure includes a metal void.

7. A method for analyzing a semiconductor device, according to claim 6, wherein the metal void results from at least one of:

canal patterning, conductive film deposition, and canal fill, and interconnect contact fill.

8. A method for analyzing a semiconductor device, according to claim 1, wherein the conductive structure has undergone Damascene processing.

9. A method for analyzing a semiconductor device, according to claim 1, further comprising:

generating a scanning map of the at least one defect; and

using the scanning map, determining the location in the device of the at least one defect.

10. A method for analyzing a semiconductor device, according to claim 9, further comprising:

analyzing at least one additional semiconductor device;

generating a second scanning map of the additional device; and

using the scanning maps, generating a defect pattern for a production lot of manufactured semiconductor devices.

11. A method for analyzing a semiconductor device, according to claim 9, wherein generating a scanning map includes generating a three-dimensional scanning map.

12. A method for analyzing a semiconductor device, according to claim 1, wherein the semiconductor device comprises a plurality of metal conductor layers, and wherein generating acoustic energy in the device includes adjusting the acoustic energy to analyze a target portion of one of the layers.

13. A method for analyzing a semiconductor device, according to claim 12, wherein the target portion includes at least one of:

an interconnect contact and a canal.

14. A method for analyzing a semiconductor device, according to claim 10, wherein generating acoustic energy in the device includes adjusting the acoustic energy to analyze a target portion of each semiconductor device, and wherein generating a defect pattern includes generating a defect pattern for the target portion in each analyzed semiconductor device.

15. A method for analyzing a semiconductor device, according to claim 9, wherein the scanning map is generated for the entire device.

16. A method for analyzing a semiconductor device, according to claim 1, wherein detecting an acoustic wave comprises using a photo-optic detector arranged to retrieve reflections from material.

17. A method for manufacturing a semiconductor device comprising:

forming conductive structure;

generating acoustic energy in the device;

detecting an acoustic wave;

calculating an index of refraction of a portion of the conductive structure as a function of the wave;

using the calculated index of refraction and determining whether a defect exists in the device; and

responsive to detecting whether a defect exists in the device, controlling the manufacture of the device.

18. A method for manufacturing a semiconductor device, according to claim 17, wherein controlling the manufacture of the device comprises:

repairing the semiconductor device, responsive to detecting a defect; and

continuing to manufacture the semiconductor device.

19. A method for manufacturing a semiconductor device, according to claim 17, wherein controlling the manufacture of the device comprises continuing to manufacture the semiconductor device, responsive to not detecting a defect.

20. A system for analyzing a semiconductor device having a conductive structure, the system comprising:

means for mounting a semiconductor device;

a laser source adapted to direct a laser beam at the device and generate acoustic energy;

means for detecting acoustic energy propagation in the device;

means for calculating an index of refraction of a portion of the conductive structure as a function of the detected acoustic energy;

means for using the calculated index of refraction and detecting at least one defect in the device.