Wafer polishing device with movable window
First Claim
1. A method for performing chemical mechanical polishing on a wafer, the method comprising:
- (a) providing a polishing element comprising a polishing surface and a window comprising a first surface, the window being movably disposed within the polishing element to move between first and second positions, the first surface being closer to the polishing surface in the second position than in the first position;
(b) performing chemical mechanical polishing on a wafer with the polishing element; and
(c) during chemical mechanical polishing of the wafer, moving the window to the second position.
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Abstract
A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.
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Citations
20 Claims
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1. A method for performing chemical mechanical polishing on a wafer, the method comprising:
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(a) providing a polishing element comprising a polishing surface and a window comprising a first surface, the window being movably disposed within the polishing element to move between first and second positions, the first surface being closer to the polishing surface in the second position than in the first position;
(b) performing chemical mechanical polishing on a wafer with the polishing element; and
(c) during chemical mechanical polishing of the wafer, moving the window to the second position. - View Dependent Claims (2)
(d) when the window is in the second position, performing an in-situ measurement of the wafer.
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3. A chemical mechanical polishing element comprising:
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a polishing surface; and
a window comprising a first surface and movably disposed within the polishing element to move between first and second positions, the first surface being closer to the polishing surface in the second position than in the first position. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A chemical mechanical polisher operative to perform chemical mechanical polishing on a wafer, the chemical mechanical polisher comprising:
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a chemical mechanical polishing element comprising;
a polishing surface; and
a window comprising a first surface and movably disposed within the polishing element to move between first and second positions, the first surface being closer to the polishing surface in the second position than in the first position; and
a window displacement mechanism operative to move the window within the polishing element;
wherein the window is positioned in the chemical mechanical polishing element to move intermittently into alignment with said wafer as said wafer is undergoing chemical mechanical polishing. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification