Wafer polishing device with movable window

• US 6,254,459 B1
• Filed: 12/06/1999
• Issued: 07/03/2001
• Est. Priority Date: 03/10/1998
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Surana, Rahul K., Jew, Stephen C., Pecen, Jiri, Bajaj, Rajeev, Litvak, Herbert E.
• Primary Examiner(s): Rose, Robert A.
• Application Number:
  US09/455,292
• Time in Patent Office: 575 Days
• Field of Search: 451/6, 451/8, 451/41, 451/287, 451/288, 451/527, 451/530, 451/533, 451/921
• US Class Current: 451/41
• CPC Class Codes: B24B 21/04 for grinding plane surfaces
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 49/12 involving optical means
• CPC Class Codes: B24D 7/12 with apertures for inspecting the surface to be abraded

Abstract

A wafer polishing device with movable window can be used for in-situ monitoring of a wafer during CMP processing. During most of the CMP operation, the window remains below a polishing surface of a polishing device to protect the window from the deleterious effects of the polishing process. When the window moves into position between the wafer and a measurement sensor, the window is moved closer to the polishing surface. In this position, at least some polishing agent collected in the recess above the window is removed, and an in-situ measurement can be taken with reduced interference from the polishing agent. After the window is positioned away from the wafer and measurement sensor, the window moves farther away from the wafer and polishing surface. With such a movable window, the limitations of current polishing devices are overcome.

Claims

1. A method for performing chemical mechanical polishing on a wafer, the method comprising:

(a) providing a polishing element comprising a polishing surface and a window comprising a first surface, the window being movably disposed within the polishing element to move between first and second positions, the first surface being closer to the polishing surface in the second position than in the first position;

(b) performing chemical mechanical polishing on a wafer with the polishing element; and

(c) during chemical mechanical polishing of the wafer, moving the window to the second position.

2. The method of claim 1 further comprising:

(d) when the window is in the second position, performing an in-situ measurement of the wafer.

3. A chemical mechanical polishing element comprising:

a polishing surface; and

a window comprising a first surface and movably disposed within the polishing element to move between first and second positions, the first surface being closer to the polishing surface in the second position than in the first position.

4. The invention of claim 3, wherein the first surface is substantially flush with the polishing surface in the second position.

5. The invention of claim 3, further comprising a flexible diaphragm coupling the window with the polishing element.

6. The invention of claim 3, wherein the window comprises a single-piece window.

7. The invention of claim 3, wherein the window comprises a flat-sheet window.

8. The invention of claim 3, wherein the window comprises a sliding window.

9. The invention of claim 3, wherein the window comprises a bellows window.

10. The invention of claim 3, wherein the window is affixed to the polishing element.

11. The invention of claim 3, wherein the window is integral with the polishing element.

12. The invention of claim 3, wherein the window is molded in the polishing element.

13. The invention of claim 3, wherein the first surface of the window comprises a slurry-phobic material.

14. The invention of claim 3, wherein the chemical mechanical polishing element comprising a polishing element selected from the group consisting of a linear polishing element, a rotating polishing element, and an orbital polishing element.

15. A chemical mechanical polisher operative to perform chemical mechanical polishing on a wafer, the chemical mechanical polisher comprising:

a chemical mechanical polishing element comprising;

a polishing surface; and

a window comprising a first surface and movably disposed within the polishing element to move between first and second positions, the first surface being closer to the polishing surface in the second position than in the first position; and

a window displacement mechanism operative to move the window within the polishing element;

wherein the window is positioned in the chemical mechanical polishing element to move intermittently into alignment with said wafer as said wafer is undergoing chemical mechanical polishing.

16. The invention of claim 15 further comprising an in-situ measuring device, wherein the window is positioned between the in-situ measuring device and said wafer when the window moves into alignment with said wafer.

17. The invention of claim 15 further comprising a pad conditioner comprising a pad cutting surface, wherein the first surface of the window is below the pad cutting surface of the pad conditioner in the first position.

18. The invention of claim 15, wherein the window displacement mechanism is operative to move the window from the first to the second position.

19. The invention of claim 15, wherein the window displacement mechanism is operative to move the window from the second to the first position.

20. The invention of claim 15, wherein the chemical mechanical polishing element comprising a polishing element selected from the group consisting of a linear polishing element, a rotating polishing element, and an orbital polishing element.