Molded packaging method for a sensing die having a pressure sensing diaphragm

• US 6,254,815 B1
• Filed: 07/29/1994
• Issued: 07/03/2001
• Est. Priority Date: 07/29/1994
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Cheperak, Michael Lan
• Primary Examiner(s): ORTIZ, ANGELA Y
• Application Number:
  US08/282,443
• Time in Patent Office: 2,531 Days
• Field of Search: 264/255, 264/271.1, 264/272.11, 264/272.15, 264/272.17, 264/272.13, 264/275, 264/294, 264/135
• US Class Current: 264/135
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/14836 Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage B29C45/14434 takes precedence
• CPC Class Codes: G01L 19/141 Monolithic housings, e.g. molded or one-piece housings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A method forms a plastic package (28) for a sensing die (10) having a pressure sensitive diaphragm (22), wherein the diaphragm (22) has a first surface (24) and a second surface (26) disposed opposite the first surface (24). According to this method, the sensing die (10) is mounted overlying a hole (18) in a die bond pad (16), which is used to support the sensing die (10) in the package (28). Next, the sensing die (10) is enclosed within a mold (12,14), and a molding material is introduced into the mold'"'"'s interior to form the package (28) around the sensing die (10). During molding, the pressures on the first and second surfaces (24,26) of the diaphragm (22) are sufficiently equal to substantially prevent damage to the sensing die (10).

Claims

1. A method of forming a package for a sensing die having a pressure sensing diaphragm, said diaphragm having a first surface and a second surface disposed opposite said first surface, comprising the steps of:

mounting said sensing die overlying a hole of a die bond pad;

enclosing said sensing die within a mold; and

introducing a molding material into said mold to form said package.

2. The method of claim 1 wherein a first pressure on said first surface of said diaphragm and a second pressure on said second surface of said diaphragm are sufficiently equal during said step of introducing a molding material to substantially prevent damage to said sensing die.

3. The method of claim 1 further comprising the step of coating a portion of said sensing die with a die coat.

4. The method of claim 3 wherein said die coat covers said first surface of said diaphragm and said second surface of said diaphragm.

5. The method of claim 3 wherein said step of coating comprises passing said die coat through said hole of said die bond pad to contact said second surface of said diaphragm.

6. The method of claim 3 wherein a first portion of said die coat touches a contact surface of said mold during said step of introducing a molding material to form at least one sensing hole in said package.

7. The method of claim 6 wherein:

said mold has a top part and a bottom part;

said first portion of said die coat touches said top part of said mold to form a first sensing hole in said package; and

a second portion of said die coat touches said bottom part of said mold to form a second sensing hole in said package.

8. The method of claim 7 wherein:

said die bond pad is connected to a lead frame; and

said lead frame comprises a plurality of leads radiating out in a direction away from said die bond pad.

9. The method of claim 8 wherein:

said package is plastic; and

said step of introducing a molding material comprises injection molding.

10. The method of claim 3 wherein said die coat substantially covers all of said diaphragm.

11. The method of claim 3 wherein said die coat is a gel.

12. The method of claim 3 wherein said die coat is a material substantially similar to silicone gel.

13. The method of claim 3 wherein said die coat comprises silicone gel.

14. The method of claim 3 wherein said die coat is a material having a Young'"'"'s modulus between about 2.0 and 4.0 MPa and having a coefficient of thermal expansion between about 150 and 300 ppm.

15. The method of claim 3 further comprising the step of substantially removing said die coat following said step of introducing a molding material.

16. The method of claim 1 wherein, during said step of introducing a molding material, said molding material passes through said hole of said die bond pad and contacts said second surface of said diaphragm.

17. A method of forming a package for a sensing die supported in said package by a die bond pad, said sensing die having a pressure sensing diaphragm, and said diaphragm having a first surface and a second surface disposed opposite said first surface, comprising the steps of:

mounting said sensing die overlying a hole of said die bond pad wherein said second surface of said diaphragm faces said hole;

coating said sensing die with a die coat wherein said die coat covers at least said first surface of said diaphragm and at least said second surface of said diaphragm;

enclosing said sensing die within a mold; and

forming said package by introducing a molding material into said mold wherein said die coat contacts a first portion of said mold to substantially exclude said molding material so that a first sensing hole is formed in said package.

18. The method of claim 17 wherein a chamber is disposed between said second surface of said diaphragm and said die bond pad.

19. The method of claim 18 wherein said die coat fills said chamber to cover said second surface of said diaphragm.

20. The method of claim 19 wherein said package comprises a first port disposed around said first sensing hole.

21. The method of claim 20 further comprising the step of capping said first port.

22. The method of claim 17 wherein said hole of said die bond pad is disposed substantially within a perimeter of said diaphragm.

23. The method of claim 17 wherein, during said step of forming said package, said die coat contacts a second portion of said mold so that a second sensing hole is formed in said package.