Fabrication of high density multilayer interconnect printed circuit boards

• US 6,255,039 B1
• Filed: 04/03/1998
• Issued: 07/03/2001
• Est. Priority Date: 04/16/1997
• Status: Expired due to Term

• Current Assignee: Isola USA Corporation (TPG Hattrick Holdco LLC)
• Original Assignee: Isola Laminate Systems Corp. (TPG Hattrick Holdco LLC)
• Inventors: Petti, Michael A., Vallance, Michael, Haas, David, Gotro, Jeffrey T., Xu, Chengzeng, Yardley, James T.
• Primary Examiner(s): Duda, Kathleen
• Application Number:
  US09/054,264
• Time in Patent Office: 1,187 Days
• Field of Search: 430/312, 430/313, 430/314, 430/316, 430/318, 428/96
• US Class Current: 430/318
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2203/1152 Replicating the surface structure of a sacrificial layer, e.g. for roughening
• CPC Class Codes: H05K 3/0023 by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/381 by special treatment of the substrate
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y10T 428/23986 With coating, impregnation, or bond

Abstract

High density built-up multilayer printed circuit boards are produced by constructing microvias with photoimageable dielectric materials. A photosensitive dielectric composition on a conductive foil is laminated to conductive lines on a core. After imaging the foil and imaging and curing the photosensitive dielectric composition, vias are formed to the conductive lines. Thereafter the conductive lines are connected through the vias to the conductive foil, and then the conductive foil is patterned.

Claims

1. A process for producing a printed circuit board which comprises;

(a) attaching a photosensitive element onto a pattern of conductive lines on the surface of a substrate wherein there are spaces between the conductive lines;

which photosensitive element comprises a negative working photosensitive dielectric composition on a surface of a conductive foil, such that the photosensitive dielectric composition is positioned on the conductive lines and in the spaces between the conductive lines;

(b) applying a layer of a photoresist onto an opposite surface of said foil;

(c) imagewise exposing the photoresist to actinic radiation and developing the photoresist to thereby form imagewise removed and imagewise nonremoved portions of the photoresist such that the imagewise removed portions are above at least one conductive line;

(d) removing the portion of the conductive foil underlying the imagewise removed portions of the photoresist without removing the underlying photosensitive dielectric composition;

(e) imagewise exposing a portion of the photosensitive dielectric composition to actinic radiation through the removed portions of the conductive foil;

developing the photosensitive dielectric composition to thereby form imagewise removed and imagewise nonremoved portions of the photosensitive dielectric composition such that the imagewise removed portion form vias to the conductive lines;

(f) curing the nonremoved portions of the photosensitive dielectric composition;

(g) electrically connecting the conductive lines though the vias to a part of the conductive foil; and

(h) patterning the conductive foil to thereby produce a pattern of conductive foil lines.

2. The process of claim 1 further comprising repeating steps (a) through (h) at least once by attaching another photosensitive element according to step (a) onto the previously patterned conductive foil lines resulting from step (h).

3. The process of claim 1 wherein step (g) comprises plating a metal through the vias from the conductive lines to a part of the conductive foil.

4. The process of claim 1 wherein step (g) comprises performing an electroless metal plating through the vias from the conductive lines to a part of the conductive foil.

5. The process of claim 1 wherein step (g) comprises performing an electroless metal plating through the vias from the conductive lines to a part of the conductive foil followed by performing a metal electroplating step.

6. The process of claim 1 wherein step (g) comprises filling the vias with a conductive paste or organometallic compound.

7. The process of claim 1 wherein step (f) is conducted by heating at a temperature of from about 90°

C. to about 250°

C.

8. The process of claim 1 wherein the foil comprises copper, copper alloys, aluminum or aluminum alloys.

9. The process of claim 1 wherein the conductive lines comprise copper, copper alloys, aluminum or aluminum alloys.

10. The process of claim 1 wherein the substrate comprises an insulating material.

11. The process of claim 1 wherein the photoresist is a negative working photosensitive composition.

12. The process of claim 1 wherein the photoresist is a positive working photosensitive composition.

13. The process of claim 1 wherein the photoresist is exposed through a first photographic mask and the photosensitive dielectric composition is exposed through a different second photographic mask.

14. A process for producing a printed wiring board which comprises:

(a) applying a layer of a negative working photosensitive dielectric composition onto a surface of a conductive foil thereby forming a photosensitive element;

(b) attaching the conductive foil via the photosensitive dielectric composition onto a pattern of conductive lines on the surface of a substrate wherein there are spaces between the conductive lines;

(c) applying a layer of a photoresist onto an opposite surface of said foil;

(d) imagewise exposing the photoresist to actinic radiation and developing the photoresist to thereby form imagewise removed and imagewise nonremoved portions of the photoresist such that the imagewise removed portions are above at least one conductive line;

(e) removing the portions of the conductive foil underlying the imagewise removed portions of the photoresist without removing the underlying photosensitive dielectric compositions;

(f) imagewise exposing a portion of the photosensitive dielectric composition to actinic radiation through the removed portions of the conductive foil;

developing the photosensitive dielectric composition to thereby form imagewise removed and imagewise nonremoved portions of the photosensitive dielectric composition such that the imagewise removed portions form vias to the conductive lines;

(g) curing the nonremoved portions of the photosensitive dielectric composition;

(h) electrically connecting the conductive lines thought the vias to a part of the conductive foil; and

(i) patterning the conductive foil to thereby produce a pattern of conductive foil lines.

15. The process of claim 14 further comprising repeating steps (a) through (i) at least once by attaching another photosensitive element according to step (a) onto the previously patterned conductive foil lines resulting from step (i).

16. A process for producing a printed circuit board which comprises;

(a) attaching a photosensitive element onto a pattern of conductive lines on the surface of a substrate;

which photosensitive element comprises a negative working photosensitive dielectric composition on a surface of a conductive foil, such that the photosensitive dielectric composition is positioned on the conductive lines;

(b) removing the conductive foil to expose the photosensitive dielectric composition wherein the exposed photosensitive dielectric composition has a microroughened surface;

(c) imagewise exposing a portion of the microroughened photosensitive dielectric composition to actinic radiation and developing the dielectric composition to thereby form imagewise removed and imagewise nonremoved portions of the microroughened dielectric composition such that the imagewise removed portions are above at least one conductive line;

(d) curing the nonremoved portions of the microroughened photosensitive dielectric compositions;

(e) simultaneously forming an electrically conductive layer on the microroughened surface of the nonremvoed protions of the dieletric composition and electrically connecting the conductive lines through the vias to the electrically conductive layer; and

(f) patterning the electrically conductive layer to thereby produce a pattern of conductive lines.

17. The process of claim 16 further comprising repeating steps (a) through (f) at least once by attaching another photosensitive element according to step (a) onto the previously pattered conductive lines resulting from step (f).

18. The process of claim 16 wherein step (e) comprises plating a metal through the vias from the conductive lines to the electrically conductive layer.

19. The process of claim 16 wherein step (e) comprises performing an electroless metal plating through the vias from the conductive lines followed by performing a metal electroplating step from the conductive lines to the electrically conductive layer.

20. The process of claim 16 wherein the foil comprises copper, copper alloys, aluminum or aluminum alloys.

21. The process of claim 16 wherein the conductive lines comprise copper, copper alloys, aluminum or aluminum alloys.

22. The process of claim 16 wherein the substrate comprises an insulating material.

23. A process for producing a printed circuit board which comprises

(a) applying a layer of negative working photosensitive dielectric composition onto a surface of a conductive foil thereby forming a photoseneitive element;

(b) attaching a conductive foil via the photosensitive dielectric composition onto a pattern of conductive lines on the surface of a substrate;

(c) removing the conductive foil to expose the photosensitive dielectric composition wherein the exposed photosensitive dielectric composition has a microroughened surface;

(d) imagewise exposing a portion of the microroughened photosensitive dielectric composition to actinic radiation and developing the microroughened dielectric composition to thereby form imagewise removed and imagewise nonremoved portions of the microroughened dielectric composition such that the imagewise removed portions are above at least one conductive line thus forming vias to the conductive lines;

(e) curing the nonremoved portions of the microroughened photosensitive dielectric composition;

(f) simultaneously forming an electrically conductive layer on the microroughened surface of the nonremoved portions of the dielectric composition and electrically connecting the conductive lines though the vias to the electrically conductive layer; and

(g) patterning the electrically conductive layer to thereby produce a pattern of conductive lines.

24. The process of claim 23 further comprising repeating steps (a) through (g) at least once by attaching another photosensitive element according to step (a) onto the previously pattered conductive foil lines resulting from step (g).