Thermally conductive compound and semiconductor device using the same

• US 6,255,376 B1
• Filed: 07/27/1998
• Issued: 07/03/2001
• Est. Priority Date: 07/28/1997
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Maeda, Toshihiko, Shikata, Kunihide
• Primary Examiner(s): Michl, Paul R.
• Application Number:
  US09/123,756
• Time in Patent Office: 1,072 Days
• Field of Search: 524/404, 524/430, 524/440
• US Class Current: 524/404
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08K 3/28 Nitrogen-containing compounds
• CPC Class Codes: C08K 5/0016 Plasticisers
• CPC Class Codes: C08L 23/08 Copolymers of ethene C08L23/16 takes precedence
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A thermally conductive compound which comprises 15 to 60 volume % of thermoplastic carrier resin consisting of a copolymer of a plasticizer with ethylene or of a polymer of the plasticizer, polyethylene and the copolymer, 40 to 85 volume % of thermally conductive filler particles dispersed in the carrier resin, and 0.5 to 5 weight % (for the filler particles) of a dispersing agent having (a) hydrophilic group(s) and (a) hydrophobic group(s). The thermally conductive compound has a high thermal conductivity and a plasticity in the range of temperatures of −40 to 50° C., and when it is interposed between an insulator body and a semiconductor element mounted thereon or between the semiconductor element and a cap, the heat generated by an operation of the semiconductor element is rapidly transferred and the thermal stress caused by the difference of coefficients of thermal expansion between the semiconductor element and the insulator body or cap is absorbed and relieved to cause no phase separation between them. The semiconductor device using the thermal compound, accordingly, is highly reliable.

Claims

1. A thermally conductive compound comprising:

15 to 60 volume % of a thermoplastic carrier resin comprising, a copolymer of ethylene and at least one monomer selected from the group consisting of vinyl acetate, acrylic acid esters and methacrylic acid esters, or a blend a polyethylene and said copolymer;

40 to 85 volume % of at least one thermally conductive filler particles selected from the group consisting of aluminum nitride, boron nitride, aluminum oxide, aluminum, silver, copper and diamond, the thermally conductive filler particles dispersed in the carrier resin; and

at least one dispersing agent selected from the group consisting of glycerin fatty acid esters, polymers of glycerin fatty acid esters, organic silanes having both hydrophilic groups and hydrophobic groups, and organic titanates having both hydrophilic groups and hydrophobic groups, at a rate of 0.5 to 5 weight % based on the filler particles, wherein the thermally conductive compound has a thermal conductivity of at least 1 W/m·

K and wherein the thermally conductive compound maintains sufficient plasticity between −

40 and 50°

C. to neutralize thermal stress caused by components that are held in contact with the thermally conductive compound having different coefficients of thermal expansion.

2. The thermally conductive compound of claim 1, wherein the acrylic acid ester is at least one of methyl acrylate, ethyl acrylate, n-butyl acrylate, 2-ethylhexyl acrylate, and 2-hydroxyethyl acrylate.

3. The thermally conductive compound of claim 1, wherein the methacrylic acid ester is at least one of n-butyl methacrylate, 2-ethylhexyl methacrylate, and hydroxypropyl methacrylate.

4. The thermally conductive compound of claim 1, wherein the particle size of the filler particles is 1 μ

m or larger in diameter.