Method for making smart cards using isotropic thermoset adhesive materials
First Claim
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1. A process for making a smart card comprising a top layer, a core layer in which an ITA-based circuit is embedded and a bottom layer, said process comprising:
- (1) associating a splitter edge device with a ITA-based circuit to form a splitter edge device/ITA-based circuit assembly;
(2) placing the splitter edge device/ITA-based circuit assembly in a gate region wherein a liquid thermosetting material is injected into a void space between the top layer and the bottom layer;
(3) placing the splitter edge device/ITA-based circuit assembly over a bottom layer of a polymeric material in a bottom mold;
(4) positioning a top layer under a top mold;
(5) closing the top mold to the bottom mold in a manner that creates a void space between the top layer and bottom layer;
(6) injecting the liquid thermosetting polymeric material into the void space at temperature and pressure conditions which are such that;
(a) the ITA-based circuit is immersed in a central region of the thermosetting material, (b) the ITA-based circuit is not in contact with the bottom layer, (c) at least one layer of the smart card is at least partially molded into a cavity in the top mold, (d) gases are driven out of the void space, (e) the ITA-based circuit is encapsulated in a cured form of the thermosetting polymeric material and (f) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor smart card body;
(7) removing the unified precursor smart card body from the mold device; and
(8) trimming the precursor smart card to a desired dimension to produce a smart card.
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Abstract
Smart cards employing ITA-based circuits can be made by associating a splitter edge material with the ITA-based circuit in order to direct an incoming stream of thermosetting polymeric above and below the ITA-based circuit.
296 Citations
25 Claims
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1. A process for making a smart card comprising a top layer, a core layer in which an ITA-based circuit is embedded and a bottom layer, said process comprising:
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(1) associating a splitter edge device with a ITA-based circuit to form a splitter edge device/ITA-based circuit assembly;
(2) placing the splitter edge device/ITA-based circuit assembly in a gate region wherein a liquid thermosetting material is injected into a void space between the top layer and the bottom layer;
(3) placing the splitter edge device/ITA-based circuit assembly over a bottom layer of a polymeric material in a bottom mold;
(4) positioning a top layer under a top mold;
(5) closing the top mold to the bottom mold in a manner that creates a void space between the top layer and bottom layer;
(6) injecting the liquid thermosetting polymeric material into the void space at temperature and pressure conditions which are such that;
(a) the ITA-based circuit is immersed in a central region of the thermosetting material, (b) the ITA-based circuit is not in contact with the bottom layer, (c) at least one layer of the smart card is at least partially molded into a cavity in the top mold, (d) gases are driven out of the void space, (e) the ITA-based circuit is encapsulated in a cured form of the thermosetting polymeric material and (f) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor smart card body;
(7) removing the unified precursor smart card body from the mold device; and
(8) trimming the precursor smart card to a desired dimension to produce a smart card. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification