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Method for making smart cards using isotropic thermoset adhesive materials

  • US 6,256,873 B1
  • Filed: 03/12/1999
  • Issued: 07/10/2001
  • Est. Priority Date: 03/17/1998
  • Status: Expired due to Term
First Claim
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1. A process for making a smart card comprising a top layer, a core layer in which an ITA-based circuit is embedded and a bottom layer, said process comprising:

  • (1) associating a splitter edge device with a ITA-based circuit to form a splitter edge device/ITA-based circuit assembly;

    (2) placing the splitter edge device/ITA-based circuit assembly in a gate region wherein a liquid thermosetting material is injected into a void space between the top layer and the bottom layer;

    (3) placing the splitter edge device/ITA-based circuit assembly over a bottom layer of a polymeric material in a bottom mold;

    (4) positioning a top layer under a top mold;

    (5) closing the top mold to the bottom mold in a manner that creates a void space between the top layer and bottom layer;

    (6) injecting the liquid thermosetting polymeric material into the void space at temperature and pressure conditions which are such that;

    (a) the ITA-based circuit is immersed in a central region of the thermosetting material, (b) the ITA-based circuit is not in contact with the bottom layer, (c) at least one layer of the smart card is at least partially molded into a cavity in the top mold, (d) gases are driven out of the void space, (e) the ITA-based circuit is encapsulated in a cured form of the thermosetting polymeric material and (f) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor smart card body;

    (7) removing the unified precursor smart card body from the mold device; and

    (8) trimming the precursor smart card to a desired dimension to produce a smart card.

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