Thermal conductive unit and thermal connection structure using the same

• US 6,257,328 B1
• Filed: 06/11/1999
• Issued: 07/10/2001
• Est. Priority Date: 10/14/1997
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Nishiki, Naomi, Fujiwara, Norio, Akiba, Yasuhiro, Watanabe, Tetsuyuki
• Primary Examiner(s): Lazarus, Ira S.
• Assistant Examiner(s): DUONG, THO V
• Application Number:
  US09/319,774
• Time in Patent Office: 760 Days
• Field of Search: 165/104.33, 165/185, 165/46.HP, 361/700, 361/687, 257/715
• US Class Current: 165/185
• CPC Class Codes: F28F 13/00 Arrangements for modifying heat-transfer, e.g. increasing, decreasing F28F1/00 - F28F11/00 take precedence
• CPC Class Codes: F28F 21/02 of carbon, e.g. graphite
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In a heat conducting unit, a heat conducting member composed of a material with good heat conductivity shaped in correspondence with the shape of a heat path is contained in a container made of a flexible sheet having a given thickness. The heat conducting member contained in the container connects at least two parts at different temperatures to form the heat path for efficiently transferring heat generated in a higher-temperature part to a lower-temperature part. Heat is dissipated away from the lower-temperature part through the heat path to cool the higher-temperature part.

Claims

1. A heat conducting unit for use with a high temperature part and a low temperature part, and for use in transferring heat generated in the high temperature part to the low temperature part via a heat path, said heat conducting unit comprising:

a container composed of a flexible sheet; and

at least one flexible graphite sheet, capable of being shaped in accordance with the heat path, located in said container and thermally connected to said flexible sheet of said container;

wherein said at least one graphite sheet is to be thermally connected to the high temperature part and the low temperature part via said flexible sheet and is to be shaped in accordance with the heat path;

wherein said flexible sheet is composed of a high-molecular compound; and

wherein said high-molecular compound is polyester having a thickness of 20 to 30 μ

m.