Packaged mirror including mirror travel stops

• US 6,257,491 B1
• Filed: 03/06/2000
• Issued: 07/10/2001
• Est. Priority Date: 10/25/1993
• Status: Expired due to Fees

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Inventors: Grossfeld, Henry, Dvorkis, Paul, Fazekas, Peter, Tan, Chinh, Stern, Miklos
• Primary Examiner(s): TREMBLAY, MARK STEPHEN
• Application Number:
  US09/519,576
• Time in Patent Office: 491 Days
• Field of Search: 235/462.36, 235/462.33, 359/214
• US Class Current: 235/462.36
• CPC Class Codes: G06K 7/10574 Multiple sources
• CPC Class Codes: G06K 7/10643 Activating means
• CPC Class Codes: G06K 7/10653 using flexible or piezoelectric means
• CPC Class Codes: G06K 7/10702 Particularities of propagating elements, e.g. lenses, mirrors G06K7/10831 takes precedence
• CPC Class Codes: G06K 7/10742 including a diffuser for diffusing the light from the light source to create substantially uniform illumination of the target record carrier
• CPC Class Codes: G06K 7/10811 Focalisation
• CPC Class Codes: H01S 5/005 Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping H01S5/026, H01S5/18388 take precedence
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
• CPC Class Codes: H01S 5/423 having a vertical cavity

Abstract

An integrated optical module for an optical scanner has a lens spaced from a vertical-cavity surface-emitting laser (VCSEL) by a spacer of defined dimensions. The module, in an alternative embodiment, includes a wafer frame, a suspended mirror mounted for oscillation on the frame, a wafer substrate bonded beneath the frame and a wafer cover bonded above the frame. The cover includes a mirror travel stop to protect the mirror against shocks. A VCSEL mounted to the wafer cover produces a beam which is shaped and deflected by a diffractive optical element onto the oscillating mirror. The reflected beam passes out of the module toward an indicia to be read. Large numbers of such devices may be fabricated relatively cheaply using wafer-scale processing and assembly technology. Three large wafers are fabricated corresponding respectively to arrays of substrates, frames and covers. The large wafers are bonded together in a sandwich arrangement, and are then diced to produce the individual scan modules. The modules may provide either one-dimensional or two-dimensional scanning.

Claims

1. A mirror subassembly, comprising:

a base;

electrodes mounted on said base for supplying electrical energy to said mirror subassembly;

a support mounted on said base;

a mirror mounted on said support, said mirror oscillating in response to the electrical energy supplied by said electrodes;

an overlay mounted on said support opposite said base, said overlay including a mirror stop to limit movement of the mirror when the mirror subassembly is subjected to a mechanical shock, said mirror stop being spaced apart from said electrodes; and

a transparent cover mounted on said overlay opposite said support.

2. The mirror subassembly according to claim 1, wherein said base includes a mirror stop to limit movement of the mirror.

3. The mirror subassembly according to claim 1, where said base and said support together define a recess, said mirror being suspended across and contained within said recess.

4. The mirror subassembly according to claim 1, wherein at least part of said base comprises a resin.

5. The mirror subassembly according to claim 1, wherein said mirror is suspended by hinges.

6. The mirror subassembly according to claim 5, wherein said mirror stop comprises cantilevered protrusions extending inwardly from edges of said overlay, said protrusions being positioned immediately above each of said hinges.

7. The mirror subassembly according to claim 1, wherein said mirror stop comprises cantilevered protrusions extending inwardly from edges of said overlay.

8. The mirror subassembly according to claim 1, wherein at least part of said support comprises silicon.

9. The mirror subassembly according to claim 1, wherein at least part of said overlay comprises a plastic material.

10. A mirror subassembly, comprising:

a base;

electrodes mounted on said base for supplying electrical energy to said mirror subassembly;

a support mounted on said base;

a mirror mounted on said support, said mirror oscillating in response to the electrical energy supplied by said electrodes;

an overlay mounted on said support opposite the base, at least one of said base and said overlay including a mirror stop to limit movement of the mirror, said mirror stop having a roughened surface; and

a transparent cover mounted on said overlay opposite said support.

19. The mirror subassembly according to claim 10, wherein said roughened surface prevents damage to the mirror subassembly by preventing slippage between the mirror stop and the mirror should the mirror contact said mirror stop.

11. A mirror subassembly, comprising:

a base;

electrodes mounted on said base for supplying electrical energy to said mirror subassembly;

a support mounted on said base;

a mirror mounted on said support, said mirror oscillating in response to the electrical energy supplied by said electrodes;

an overlay mounted on said support opposite said base, said overlay including a mirror stop to limit movement of the mirror, said mirror stop comprising cantilevered protrusions extending inwardly from edges of said overlay; and

a transparent cover mounted on said overlay opposite said support.

12. The mirror subassembly according to claim 11, wherein said base includes a mirror stop to limit movement of the mirror.

13. The mirror subassembly according to claim 11, wherein said base and said support together define a recess, said mirror being suspended across and contained within said recess.

14. The mirror subassembly according to claim 11, wherein at least part of said base comprises a resin.

15. The mirror subassembly according to claim 11, wherein said mirror is suspended by hinges.

16. The mirror subassembly according to claim 15, wherein said cantilevered protrusions are positioned immediately above each of said hinges.

17. The mirror subassembly according to claim 11, wherein at least part of said support comprises silicon.

18. The mirror subassembly according to claim 11, wherein at least part of said overlay comprises a plastic material.