In-situ electroless copper seed layer enhancement in an electroplating system

• US 6,258,223 B1
• Filed: 07/09/1999
• Issued: 07/10/2001
• Est. Priority Date: 07/09/1999
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Dordi, Yezdi, Morad, Ratson, Smith, Paul F., Chen, Liang-Yuh, Cheung, Robin, Hey, Peter, Sinha, Ashok K., Carl, Daniel A.
• Primary Examiner(s): Gorgos, Kathryn
• Assistant Examiner(s): SMITH HICKS, ERICA D
• Application Number:
  US09/350,877
• Time in Patent Office: 732 Days
• Field of Search: 204/242, 204/267, 204/269
• US Class Current: 204/242
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: H01L 21/68721 characterised by edge clamping, e.g. clamping ring
• CPC Class Codes: H01L 21/68728 characterised by a plurality of separate clamping members, e.g. clamping fingers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention discloses a system that provides for electroless deposition performed in-situ with an electroplating process to minimize oxidation and other contaminants prior to the electroplating process. The system allows the substrate to be transferred from the electroless deposition process to the electroplating process with a protective coating to also minimize oxidation. The system generally includes a mainframe having a mainframe substrate transfer robot, a loading station disposed in connection with the mainframe, one or more processing facilities disposed in connection with the mainframe, an electroless supply fluidly connected to the one or more processing applicators and optionally includes a spin-rinse-dry (SRD) station, a rapid thermal anneal chamber and a system controller for controlling the deposition processes and the components of the electro-chemical deposition system.

Claims

1. A system for depositing a conductive layer on a substrate, comprising:

an electroplating processing mainframe having a transfer robot and one or more electroplating cells;

an electroless deposition applicator coupled to the mainframe, the applicator comprising a nozzle positioned to distribute electroless deposition fluid over the substrate; and

an electroless deposition fluid supply fluidly connected to the electroless deposition applicator.

2. The system of claim 1, wherein the nozzle is disposed above the mainframe and positioned above a path of the substrate being transferred by the transfer robot.

3. The system of claim 2, wherein the nozzle is disposed proximate to a substrate pass-through cassette disposed on the mainframe.

4. The system of claim 1, wherein the nozzle is disposed in an electroless deposition process (EDP) cell.

5. The system of claim 4, wherein the EDP cell comprises a pedestal for supporting the substrate in the EDP cell.

6. The system of claim 5, wherein the EDP cell comprises an actuator disposed in connection with the pedestal to rotate the pedestal.

7. The system of claim 5, wherein the EDP cell comprises a rinse fluid inlet disposed proximate to the pedestal and fluidly connected to a supply of rinsing fluid.

8. The system of claim 5, wherein the nozzle is disposed proximate to a center of the pedestal and coupled to an articulating member.

9. The system of claim 8, further comprising an actuator coupled to the articulating member to move the nozzle from a central position above the pedestal to a peripheral position proximate to a sidewall of the EDP cell.