Polyamide composition

• US 6,258,927 B1
• Filed: 01/31/2000
• Issued: 07/10/2001
• Est. Priority Date: 01/29/1999
• Status: Expired due to Term

• Current Assignee: Kurary Co., Ltd.
• Original Assignee: Kuraray Company Limited
• Inventors: Tamura, Kozo, Kuki, Toru, Oka, Hideaki
• Primary Examiner(s): HAMPTON HIGHTOWER, PATRICIA
• Application Number:
  US09/494,046
• Time in Patent Office: 526 Days
• Field of Search: 528/310, 528/322, 528/170, 524/401, 524/405, 524/412, 524/432, 524/469, 524/600, 524/606
• US Class Current: 528/310
• CPC Class Codes: C08K 3/24 Acids; Salts thereof C08K3/16 takes precedence
• CPC Class Codes: C08K 3/38 Boron-containing compounds
• CPC Class Codes: C08K 5/03 aromatic , e.g. C6H5-CH2-Cl
• CPC Class Codes: C08L 77/00 Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08; Compositions of derivatives of such polymers
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence

Abstract

A polyamide composition, comprising:

(A) 100 parts by weight of a polyamide,

(B) from 10 to 200 parts by weight of an aromatic ring-containing bromine compound, and

(C) from 0.1 to 100 parts by weight of at least one flame-retardant synergist selected from metal salts of stannic acid and alkaline earth metal salts of boric acid. The polyamide composition has good flame retardancy and heat resistance, and exhibits good thermal stability and continuous moldability when molded in melt, and it can be molded into good moldings having excellent appearances, especially fine color tone, without giving much gas.

Claims

1. A polyamide composition, comprising:

(A) 100 parts by weight of a polyamide,

(B) from 10 to 200 parts by weight of an aromatic ring-containing bromine compound, and

(C) from 0.1 to 200 parts by weight of at least one flame-retardant synergist selected from the group consisting of metal salts of stannic acid and alkaline earth metal salts of boric acid, wherein the polyamide (A) comprises (a) dicarboxylic acid units of which from 60 to 100 mol % are terephthalic acid units and (b) diamine units of which from 60 to 100 mol % are C_6-18 aliphatic alkylenediamine units, and wherein the aliphatic alkylenediamine units are 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units.

2. The polyamide composition of claim 1, which further comprises (D) from 0.1 to 200 parts by weight, relative to 100 parts by weight of the polyamide (A), of a filler.

3. The polyamide composition of claim 1, wherein (B) comprises at least one member selected from the group consisting of aromatic ring-containing brominated polymers and aromatic ring-containing low-molecular bromine compounds.

4. The polyamide composition of claim 1, wherein (B) comprises at least one member selected from the group consisting of brominated polystyrenes, brominated polyphenylene ethers, brominated phenoxy resins and ethylene-bis-[tetrabromophthalimide].

5. The polyamide composition of claim 1, wherein (C) comprises at least one member selected from the group consisting of zinc stannate, zinc hydroxystannate, magnesium stannate, cobalt stannate, sodium stannate, potassium stannate, calcium borate, and magnesium borate.

6. A molding of the polyamide composition of claim 1.

7. A method of making a polyamide mold, comprising molding the polyamide composition of claim 1.

8. A method of making the polyamide of claim 1, comprising combining (A), (B) and (C).