Surface mount connector with pins in vias

• US 6,259,039 B1
• Filed: 12/29/1998
• Issued: 07/10/2001
• Est. Priority Date: 12/29/1998
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Ekhlassi, Hamid, Chroneos, Robert J. Jr.
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): Cuneo, Kamand
• Application Number:
  US09/222,604
• Time in Patent Office: 924 Days
• Field of Search: 174/262, 174/263, 174/264, 174/266, 361/772, 361/773, 361/774, 361/783, 361/791, 361/768, 439/83, 439/876
• US Class Current: 174/263
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H01R 43/0256 for soldering or welding connectors to a printed circuit board
• CPC Class Codes: H05K 1/114 Pad being close to via, but not surrounding the via
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10871 Leads having an integral insert stop
• CPC Class Codes: H05K 2201/10878 Means for retention of a lead in a hole
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

A surface mountable pin connector has a substrate or a circuit board carrier, which has a number of through holes or vias formed therein, and a number of connector pins, each of which is soldered into a respective one of the through holes with high melt temperature solder. A damming device or protrusion is located on each pin nearer to the shoulder than typical interference fit protrusions. The damming device is sized and shaped to completely block the through hole or via.

Claims

1. A circuit interconnect, comprising:

a circuit board carrier having a plurality of plated through holes formed therein;

a plurality of pins, each pin being soldered into a respective one of the plurality of plated through holes;

a plurality of lands located over the through holes; and

a plurality of solder balls attached to the lands.

2. A circuit interconnect as described in claim 1, wherein each of the plurality of pins has a damming protrusion extending radially therefrom, the damming protrusion having a diameter closely matching the diameter of the plated through holes, the damming protrusion substantially completely damming the through hole.

3. A circuit interconnect as described in claim 1, wherein each of the plurality of pins has damming protrusion extending therefrom, the damming protrusion substantially completely blocking the through hole.

4. A circuit interconnect as described in claim 1, wherein the solder in the plurality of plated through holes is high melt temperature solder.

5. A circuit interconnect as described in claim 4, wherein the high melt temperature solder has a melting point of at least 183 degrees Centigrade.

6. A circuit interconnect as described in claim 4, wherein the high melt temperature solder has a melting point of at least 230 degrees Centigrade.

7. A circuit interconnect as described in claim 3, wherein each pin has a shoulder extending therefrom, the shoulder defining the extent of penetration of the pin into one of the through holes, and wherein the damming protrusion abuts the shoulder.

8. A circuit interconnect as described in claim 1, wherein the solder balls and the solder in the plurality of through holes have different melt temperatures.

9. A circuit interconnect as described in claim 8, wherein the solder ball melt temperature is lower than the melt temperature of the solder in the plurality of through holes.

10. A circuit interconnect, comprising:

a circuit board carrier having a plurality of plated through holes formed therein;

a plurality of pins, each pin being soldered into a respective one of the plurality of plated through holes;

a plurality of lands offset from the through holes;

a metalized trace connecting each land to a plated through hole; and

a plurality of solder balls attached to the lands.

11. The circuit interconnect as described in claim 10, and further comprising:

a solder mask to prevent solder from flowing onto the vias.

12. A circuit interconnect as described in claim 10, wherein each of the plurality of pins has a damming protrusion extending therefrom, the damming protrusion substantially completely blocking the through hole.

13. A circuit interconnect as described on claim 10, wherein the solder in the plurality of through holes is high melt temperature solder.

14. A circuit interconnect as described in claim 13, wherein the high melt temperature solder has a melting point of at least 183 degrees Centigrade.

15. A circuit interconnect as described in claim 13, wherein the high melt temperature solder has a melting point of at least 230 degrees Centigrade.

16. A circuit interconnect as described in claim 10, wherein each of the plurality of pins is press fitted into one of the through holes.

17. A circuit interconnect as described in claim 10, wherein the solder balls have a melting point lower than the melting point of the high melt temperature solder.