Electronic component
First Claim
Patent Images
1. An electronic component comprising an electronic component body, an external electrode comprising a metal on the electronic component body, and a coating on the external electrode, wherein the coating comprises a tin solder containing the same metal as contained in the external electrode in an amount greater than the eutectic concentration thereof.
1 Assignment
0 Petitions
Accused Products
Abstract
A coating layer composed of a solder containing tin as the major component and a metal such as copper or silver which is the same as that contained in a external electrode in an amount greater than the eutectic concentration, is formed on the external electrode. The solder can suppress the solid-phase diffusion without formation of the barrier layer.
-
Citations
19 Claims
- 1. An electronic component comprising an electronic component body, an external electrode comprising a metal on the electronic component body, and a coating on the external electrode, wherein the coating comprises a tin solder containing the same metal as contained in the external electrode in an amount greater than the eutectic concentration thereof.
Specification