Method of producing an advanced RF electronic package

• US 6,261,872 B1
• Filed: 09/18/1997
• Issued: 07/17/2001
• Est. Priority Date: 09/18/1997
• Status: Expired due to Term

• Current Assignee: Northrop Grumman Systems Corporation (Northrop Grumman Corporation)
• Original Assignee: TRW Limited (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Inventors: Hathaway, James A., Brunone, David J., Reyes, Michelle M.
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Chambliss, Alonzo
• Application Number:
  US08/932,474
• Time in Patent Office: 1,398 Days
• Field of Search: 257/700, 257/703, 257/705, 257/704, 257/729, 257/730, 257/787, 257/723, 257/724, 438/107, 438/110, 438/125, 438/106, 438/124, 438/126, 438/127, 438/26, 438/51, 438/64
• US Class Current: 438/126
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/206 Length ranges
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as aluminum, into the ceramic of the interconnect channels. In an alternate embodiment of the invention, a polymer based integrated package, formed from a polymer, is molded around a cast base which acts as a heat sink. Interconnection between the various electronic components is made by either molding interconnect metal tracings in the polymer housing or by way of interconnection vias which are filled with polymer based conductive paste or immersion plating. In both embodiments, interconnections between electronic components forming the electronic circuit are made without the use of glass feedthroughs which greatly simplifies the cost and complexity of the package.

Claims

1. A method for forming an electronics package, the method comprising the steps:

(a) casting one or more first electronic components into ceramic preforms, for forming one or more first modular ceramic preforms;

(b) casting one or more interconnect channels forming one or more second modular ceramic preforms;

(c) casting said first and second modular ceramic preforms in a separate housing forming a modular electronics package; and

(d) forming one or more cavities in said separate housing for receiving one or more second electronic components, wherein said one or more second modular ceramic preforms interconnected said one or more first electronic components to said one or more second electronic components.

2. The method as recited in claim 1, further including the step of casting one or more feedthroughs in ceramic, forming one or more third modular ceramic preforms and casting said third modular ceramic preforms in said separate housing with said first and second modular ceramic preforms.

3. The method as recited in claim 1, wherein said separate housing formed from a composite material.

4. The method as recited in claim 3, wherein said composite material is aluminum silicon carbide (AlSiC).

5. The method as recited in claim 1, wherein said first electronic components in said one or more first modular ceramic preforms include one or more temperature durable electronic components.

7. The method as recited in claim 5, wherein said temperature durable electronic component is a capacitor.

8. The method as recited in claim 5, wherein said temperature durable electronic component is an inductor.

9. The method as recited in claim 1, wherein said modular element is a feed through.

10. The method as recited in claim 1, wherein said second electronic components are non temperature durable electronic components and include one or more integrated circuits.

6. The method as recited in 5, wherein said temperature durable component is a resistor.