Method for performing chemical-mechanical polishing
First Claim
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1. A method for performing chemical-mechanical polishing of a substrate surface, comprising:
- providing a pad having a top and a bottom surface;
placing the substrate on the top surface of the pad;
disposing the bottom surface of the pad on a platen of a chemical-mechanical polishing apparatus;
applying a releasable attractive force to the bottom surface of the pad so that the pad is pulled in the direction of the platen; and
coupling the releasable attractive force to a switch for activating and deactivating the force so that the pad can be selectively secured onto and removed from the platen; and
performing chemical mechanical polishing of a substrate surface.
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Abstract
An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may comprise a vacuum or electromagnetic force, and the pad has a hard or magnetic backside layer for facing the plating and responding to the attractive force. This invention has particular application to chemical-mechanical polishing for use in planarizing dielectrics.
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Citations
13 Claims
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1. A method for performing chemical-mechanical polishing of a substrate surface, comprising:
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providing a pad having a top and a bottom surface;
placing the substrate on the top surface of the pad;
disposing the bottom surface of the pad on a platen of a chemical-mechanical polishing apparatus;
applying a releasable attractive force to the bottom surface of the pad so that the pad is pulled in the direction of the platen; and
coupling the releasable attractive force to a switch for activating and deactivating the force so that the pad can be selectively secured onto and removed from the platen; and
performing chemical mechanical polishing of a substrate surface.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of planarizing a substrate surface with a chemical-mechanical polishing apparatus, the method comprising:
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providing a pad and a platen, the pad having a top and a bottom surface, the bottom surface of the pad having a layer of magnetic material and the platen having at least one electromagnet disposed therein, placing the substrate on the top surface of the pad so that the substrate surface to be planarized is oppositely disposed to the pad;
disposing the bottom surface of the pad having the layer of magnetic material on the platen;
activating the force exerted by the at least one electromagnet so that the layer of magnetic material is pulled in the direction of the platen;
planarizing the substrate surface; and
deactivating the force exerted by the at least one electromagnet so that the pad can be removed from the platen. - View Dependent Claims (10)
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11. A method of planarizing a substrate surface with a chemical-mechanical polishing apparatus, the method comprising:
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providing a pad and a platen, the pad having a top and a bottom surface and the platen having a plurality of holes therein traversing its width, placing the substrate on the top surface of the pad so that the substrate surface to be planarized is oppositely disposed to the pad;
disposing the bottom surface of the pad on the platen;
activating a suctioning force through the plurality of holes of the platen so that the pad is suctioned in the direction of the platen;
planarizing the substrate surface; and
deactivating the suctioning force so that the pad can be removed from the platen. - View Dependent Claims (12, 13)
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Specification