Laser-processable glass substrate and laser processing method
First Claim
1. Method of producing a glass article having at least one hole (h) or a recess, respectively, at a predetermined location in the surface thereof,characterized by the steps of providing a glass substrate (G) containing silver in the form of Ag atoms, an Ag colloid, or Ag ions, and having such a concentration gradient that the concentration of silver is greatest at said surface and progressively decreases from the surface towards the interior, and forming said at least one hole (h) or recess by irradiating said glass substrate (G) at said predetermined location with a laser beam, thereby to remove portions of said glass substrate (G) by way of melting, evaporation or ablation due to absorption of energy of said laser beam.
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Accused Products
Abstract
A sheet of silicate glass having a thickness of 2 mm and composed mainly of SiO2, and containing Al2O3, B2O3, Na2O, F, etc., is immersed in a molten salt comprising a mixture of 50 mol % of silver nitrate and 50 mol % of sodium nitrate. Na ions in the surface of the glass are eluted, diffusing Ag ions in the molten salt into the glass. When a laser beam is applied to the glass substrate thus formed, the glass substrate is evaporated or ablated progressively from its surface. The glass substrate is processed to a smooth finish without causing cracking or breakage.
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Citations
11 Claims
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1. Method of producing a glass article having at least one hole (h) or a recess, respectively, at a predetermined location in the surface thereof,
characterized by the steps of providing a glass substrate (G) containing silver in the form of Ag atoms, an Ag colloid, or Ag ions, and having such a concentration gradient that the concentration of silver is greatest at said surface and progressively decreases from the surface towards the interior, and forming said at least one hole (h) or recess by irradiating said glass substrate (G) at said predetermined location with a laser beam, thereby to remove portions of said glass substrate (G) by way of melting, evaporation or ablation due to absorption of energy of said laser beam.
Specification