Inductor formed at least partially in a substrate

• US 6,262,468 B1
• Filed: 03/03/2000
• Issued: 07/17/2001
• Est. Priority Date: 12/22/1995
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Imam, Mohamed A., Yoganathan, Sittampalam
• Primary Examiner(s): WOJCIECHOWICZ, EDWARD JOSEPH
• Application Number:
  US09/518,340
• Time in Patent Office: 501 Days
• Field of Search: 257/531, 257/281, 257/379, 257/401
• US Class Current: 257/531
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19104 on the semiconductor or solid-state device, i.e. passive-on-chip

Abstract

A method of making an inductor and the inductor. The inductor comprises a plurality of serially connected transistors at least partially formed in a substrate, preferably a silicon on insulator substrate, and comprises a gate common to the plurality of transistors. The plurality of transistors, transistor contacts, and electrical interconnects form the coil of the inductor and the gate common to the plurality of transistors forms the core of the inductor. Two inductors of the invention are magnetically coupled to form a transformer of the invention. A control transistor is serially connected to the primary inductor of the transformer. The control transistor is gated by a periodic output signal of a ring oscillator. An actuation and a deactuation of the control transistor allows the current in the primary coil to vary creating a changing magnetic flux in the primary and secondary cores and inducing a fluctuating current in the secondary coil.

Claims

1. An inductor formed at least partially in a semiconductor base layer, the inductor comprising:

a core fabricated from a gate, the core having a length and operably coupled to the semiconductor base layer; and

a coil comprising a plurality of serially connected active areas, the coil is partially formed within the semiconductor base layer and traverses at least a portion of the length of the core.

2. The inductor of claim 1, wherein the coil comprises a conductive path including a plurality of transistors.

3. The inductor of claim 2, wherein the core is a transistor gate common to the plurality of transistors.

4. The inductor of claim 3, wherein the transistor gate overlies the base layer.

5. A semiconductor structure comprising:

a semiconductor substrate;

an insulating layer formed on the substrate;

a silicon layer formed on the insulating layer;

a polysilicon layer overlying the silicon layer, the polysilicon layer is electrically isolated from the substrate and the polysilicon layer is configured to function as a transistor gate and an inductor core;

a plurality of serially connected transistors sharing the transistor gate; and

a conductive path including the plurality of serially connected transistors, wherein the conductive path encircles the inductor core.

6. The structure of claim 5, wherein the plurality of serially connected transistors function as an inductor coil.

7. An inductor structure comprising:

a substrate having a silicon layer formed on an insulator;

a plurality of active regions formed in the silicon layer;

a plurality of electrically insulative regions, each of the plurality of electrically insulative regions electrically isolating each of the plurality of active regions;

a plurality of electrical interconnects serially connecting the plurality of active regions such that the plurality of electrical interconnects and the plurality of active regions form an coil; and

a gate overlaying the plurality of active regions, wherein the gate forms an inductor core within the coil.

8. An inductor formed at least partially in a semiconductor base layer, the inductor comprising:

a core having a length, the core being fabricated from a gate formed on the semiconductor base layer; and

a coil partially formed within a plurality of active areas of the semiconductor base layer and traversing at least a portion of the length of the core, the coil comprising a plurality of conductive connections serially coupling the plurality of active areas.

9. The inductor of claim 8, wherein the core is electrically insulated from the semiconductor base layer.

10. The inductor of claim 9, wherein a portion of the core is separated from a semiconductor substrate by at least three insulating layers.

11. An inductor comprising:

at least one transistor having a gate, source and drain fabricated on a substrate having an oxide layer;

a coil including the source, the drain, and a conductor, the conductor coupled to the source and drain; and

a core formed on the gate, wherein the coil extends around the core, and the core and the conductor are formed above the oxide layer.

12. The inductor of claim 11, wherein the at least one transistor is formed by a complementary metal-oxide semiconductor process.

13. The inductor of claim 12, wherein the core is electrically insulated from the gate.

14. An inductor having a core and a coil traversing the core, the inductor comprising:

a plurality of serially connected transistors, each transistor in the plurality of serially connected transistors having a source region and a drain region surrounded by an insulative material, wherein the source region of one transistor is coupled by a conductive material to the drain region of another transistor;

a transistor gate shared by the plurality of serially connected transistors; and

a coil encircling the transistor gate and comprising a conductive path including a channel region of at least one of the transistors of the plurality of serially connected transistors.

15. The inductor of claim 14, wherein at least one of the plurality of serially connected transistors is a field-effect transistor.

16. The inductor of claim 15, wherein the transistor gate is fabricated from a single layer of polysilicon.

17. A semiconductor structure, comprising:

an insulating layer formed on a silicon substrate;

a silicon layer formed on the insulating layer;

a polysilicon layer overlaying the silicon layer, the polysilicon layer electrically isolated from the substrate and the polysilicon layer configured to function as a transistor gate and as an inductor core;

a plurality of serially connected transistors sharing the transistor gate; and

a conductive path formed from the plurality of serially connected transistors, wherein the conductive path encircles the inductor core at least twice.

18. The semiconductor structure of claim 17, wherein the silicon substrate is a p-type semiconductor.

19. The semiconductor structure of claim 18, wherein the polysilicon layer has a rectangular cross-section.

20. An inductor partially formed in a semiconductor base layer, the inductor comprising:

a core having a approximately elliptical cross-section located above an oxide layer; and

a coil formed partially in an active area of the base layer, the coil comprising serially connected source, drain, and channel regions of a plurality of transistors, wherein the core is coupled to the channel regions of the plurality of transistors to form a gate.

21. The inductor of claim 20, wherein the core has a top surface having an approximately elliptical shape.

22. The inductor of claim 20, wherein the coil has a length and a conductivity that increases along the length of the coil.

23. An inductor, comprising:

a first conductive core comprising a first metal-oxide semiconductor (MOS) transistor gate;

a first coil comprising a first MOS transistor channel region, wherein a first conductive element is coupled to the first MOS transistor channel region forming a loop around the first conductive core;

a second conductive core comprising a second MOS transistor gate, the second conductive core being electrically coupled to the first conductive core; and

a second coil comprising a second MOS transistor channel region and a second conductive element coupled to the second MOS transistor channel region to form a loop around the second conductive core, the second coil being electrically coupled to the first coil.

24. The inductor of claim 23, wherein the first conductive core is fabricated from polysilicon.

25. The inductor of claim 23, wherein the first conductive core is fabricated from a metal.

26. An inductor structure formed on a silicon on insulator wafer, the inductor structure comprising:

a plurality of active regions formed in and above an oxide layer of the silicon on insulator wafer;

a plurality of electrically insulative regions, each of the plurality of electrically insulative regions electrically isolating the plurality of active regions from each other;

a plurality of electrical interconnects located above the silicon on insulator wafer and serially connecting the plurality of active regions such that one active region is serially connected to a subsequent active region, wherein the plurality of electrical interconnects and the plurality of active regions form an inductor coil above an insulator; and

a gate overlying the plurality of active regions, wherein the gate forms an inductor core surrounded by the inductor coil.

27. The inductor structure of claim 26, wherein each of the plurality of active regions includes a drain, a source, and a channel.

28. The inductor structure of claim 26, wherein each of the plurality of electrically insulative regions is a semiconductor.