CPC Class Codes
H01L 2224/45099
Material
H01L 2224/48091
Arched
H01L 2224/48227
connecting the wire to a bo...
H01L 2224/4823
connecting the wire to a pi...
H01L 23/055
the leads having a passage ...
H01L 23/142
Metallic substrates having ...
H01L 23/3128
the substrate having spheri...
H01L 23/49811
Additional leads joined to ...
H01L 23/49816
Spherical bumps on the subs...
H01L 23/49827
Via connections through the...
H01L 24/48
of an individual wire conne...
H01L 2924/00
Indexing scheme for arrange...
H01L 2924/00014
the subject-matter covered ...
H01L 2924/01014
Silicon [Si]
H01L 2924/01046
Palladium [Pd]
H01L 2924/01078
Platinum [Pt]
H01L 2924/01087
Francium [Fr]
H01L 2924/09701
Low temperature co-fired ce...
H01L 2924/14
Integrated circuits
H01L 2924/15153
the die mounting substrate ...
H01L 2924/1517 :
Multilayer substrate
H01L 2924/15311 :
being a ball array, e.g. BGA
H01L 2924/15312 :
being a pin array, e.g. PGA
H01L 2924/1532 :
the connection portion bein...
H01L 2924/16195 :
Flat cap [not enclosing an ...
H01L 2924/30107 :
Inductance
H01L 2924/3025 :
Electromagnetic shielding
H05K 1/053 :
the metal substrate being c...
H05K 1/056 :
the metal substrate being c...
H05K 2201/0999 :
Circuit printed on or in ho...
H05K 3/4046 :
using auxiliary conductive ...
H05K 3/445 :
having insulated holes or i...
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