Substrate strip for use in packaging semiconductor chips

• US 6,262,490 B1
• Filed: 11/05/1999
• Issued: 07/17/2001
• Est. Priority Date: 11/05/1999
• Status: Expired due to Term

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Hsu, Kao-Yu, Lee, Shih Chang, Kung, Wei-Chun
• Primary Examiner(s): Tran, Minh Loan
• Assistant Examiner(s): ANDUJAR, LEONARDO
• Application Number:
  US09/434,261
• Time in Patent Office: 620 Days
• Field of Search: 257/787, 257/788, 257/678, 438/118, 438/124, 361/760-765
• US Class Current: 257/787
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A flexible substrate strip comprises a plurality of substrate units adapted for mounting semiconductor chips. The surface of the flexible substrate strip is provided with a plurality of degating regions at locations such that the edges of mold runners and gates of a mold used to encapsulate the semiconductor chips in encapsulant material fit entirely within the degating regions when the substrate strip is placed in the mold during encapsulation of the semiconductor chips. The present invention is characterized in that each degating region has a buffer region at a location corresponding to the gate of the mold during encapsulation. The degating regions have a degating region material formed thereon with the buffer regions not coated with the degating region material. The adhesive force between the encapsulant material and the degating region material is less than the adhesive force between the encapsulant material and the substrate. The present invention also provides a method of making the flexible substrate strip.

Claims

1. A substrate strip comprising:

a plurality of substrate units on a surface of the substrate strip, each substrate unit being adapted for mounting a semiconductor chip;

a plurality of degating regions on the surface of the substrate strip at locations such that the edges of mold runners and gates of a mold used to encapsulate the semiconductor chips in encapsulant material fit entirely within the degating regions when the substrate strip is placed in the mold during encapsulation of the semiconductor chips, wherein each degating region has a buffer region at a location corresponding to the gate of the mold during encapsulation; and

a degating region material formed on the degating regions with the buffer regions not coated with the degating region material, wherein the adhesive force between the encapsulant material and the degating region material is less than the adhesive force between the encapsulant material and the substrate strip.

2. The substrate strip as claimed in claim 1, wherein the substrate strip is a flexible substrate strip.

3. The substrate strip as claimed in claim 1, wherein the adhesive force between the encapsulant material and the degating region material is approximately 10% of the adhesive force between the encapsulant material and the substrate strip.

4. The substrate strip as claimed in claim 1, wherein the degating region material is gold.

5. The substrate strip as claimed in claim 1, wherein the degating region material on the degating region forms gaps corresponding to the buffer regions.

6. The substrate strip as claimed in claim 1, wherein each buffer region is entirely located within the area covered by the corresponding gate of the mold during encapsulation of the semiconductor chips.

7. The substrate strip as claimed in claim 1, wherein each buffer region is next to the corresponding substrate unit.