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Microcap wafer-level package

  • US 6,265,246 B1
  • Filed: 07/23/1999
  • Issued: 07/24/2001
  • Est. Priority Date: 07/23/1999
  • Status: Expired due to Term
First Claim
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1. A method of manufacturing a wafer package comprising:

  • providing a first wafer, a second wafer, and a micro device;

    forming a bonding pad and a peripheral pad on said first wafer, said peripheral pad encompassing said bonding pad;

    forming on said second wafer a first seal substantially matching the perimeter of said bonding pad and a second seal encompassing said first seal and matching said peripheral pad;

    forming a well in said second wafer;

    bonding said first and said second wafers together using said first and said second seals and said bonding and peripheral pads to form a hermetically sealed volume therebetween, said second wafer positionable with said well over said bonding pad, and said micro device in said hermetically sealed volume between said seals; and

    removing a portion of said second wafer whereby said well becomes a through hole in said second wafer, said through hole open to said bonding pad on said first wafer.

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