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Method of making implantable lead including laser wire stripping

  • US 6,265,691 B1
  • Filed: 07/02/1999
  • Issued: 07/24/2001
  • Est. Priority Date: 11/05/1996
  • Status: Expired due to Term
First Claim
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1. A method for removing a first insulating layer from a portion of a first conductor that is sheathed in the first insulating layer without damaging the first conductor and removing a second insulating layer from a portion of a second conductor that is sheathed in the second insulating layer without damaging the second conductor, wherein the first and second conductors are wound coaxially so as to form an implantable lead, the method comprising applying a laser beam pulse of predetermined duration and energy to portions of each of the first and second insulating layers that are to be removed.

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