Method of making implantable lead including laser wire stripping

• US 6,265,691 B1
• Filed: 07/02/1999
• Issued: 07/24/2001
• Est. Priority Date: 11/05/1996
• Status: Expired due to Term

• Current Assignee: Intermedics Incorporated (Boston Scientific Corporation)
• Original Assignee: Intermedics Incorporated (Boston Scientific Corporation)
• Inventors: Cardineau, Yan, Frankovich, Mark M.
• Primary Examiner(s): Dunn, Tom
• Assistant Examiner(s): STONER, KILEY SHAWN
• Application Number:
  US09/346,841
• Time in Patent Office: 753 Days
• Field of Search: 219/121.68, 219/121.69, 219/121.85, 216/65, 606/41
• US Class Current: 219/121.69
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/056 Transvascular endocardial electrode systems
• CPC Class Codes: H02G 1/128 using radiant energy, e.g. a laser beam

Abstract

An apparatus and method are disclosed by which a laser beam is used to remove or ablate the insulating coating from a desired segment of an insulated conductor without damaging or causing mechanical stress to the wire, so that the wire can be used to transmit electrical signals to an electrode in a implantable medical device. The invention can be applied to one or more conductors that are coiled coaxially and can be used to expose separate portions of two or more conductors if the insulating coatings thereon are differentiated in a way that causes the separate insulating coatings to respond differently to contact with a laser beam.

Claims

1. A method for removing a first insulating layer from a portion of a first conductor that is sheathed in the first insulating layer without damaging the first conductor and removing a second insulating layer from a portion of a second conductor that is sheathed in the second insulating layer without damaging the second conductor, wherein the first and second conductors are wound coaxially so as to form an implantable lead, the method comprising applying a laser beam pulse of predetermined duration and energy to portions of each of the first and second insulating layers that are to be removed.

2. The method according to claim 1, further including the step of unwinding the conductors from each other over a portion of their length prior to applying the laser beam pulse.

3. The method according to claim 1 wherein the first insulating layer and the second insulating layer are removed from the first and second conductors without unwinding the first and second conductors from each other.

4. The method according to claim 3, further including the step of providing non-identical insulating layers to the conductors such that the non-identical insulating layers respond differently to the laser beam.

5. The method according to claim 3, further including the step of providing insulating layers having different thicknesses.

6. The method according to claim 3, further including the step of providing insulating layers having different melting points.

7. The method according to claim 3, further including the step of providing insulating layers having different thermal absorptions.

8. The method according to claim 3, further including the step of providing insulating layers of different colors.

9. The method according to claim 3, further including the step of pretreating the insulating layers prior to applying the laser beam pulse so that the insulating layers are predisposed to respond differently to the laser beam.