Forming attached features on a semiconductor substrate
First Claim
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1. A microelectronic structure in a semiconductor substrate comprising:
- a small feature formed into said substrate to a predetermined depth and having sidewalls which are (111) surfaces;
a large feature formed into said substrate to a predetermined depth and having sidewalls which are (111) surfaces, wherein said large feature is at least about 10 times as deep as said small feature; and
a transition region between said small and large features, wherein said transition region has a maximum depth in said substrate which is less than about half the depth of said large feature.
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Abstract
A method for creating attached features while controlling the depth profile between the features is presented. First the features are formed with a separating barrier between the features. The separating barrier is then etched in a second step with an orientation dependent etchant to attach the two feature. This method can be used to create attached features of relative similar sizes or attached features of disparate sizes.
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Citations
13 Claims
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1. A microelectronic structure in a semiconductor substrate comprising:
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a small feature formed into said substrate to a predetermined depth and having sidewalls which are (111) surfaces;
a large feature formed into said substrate to a predetermined depth and having sidewalls which are (111) surfaces, wherein said large feature is at least about 10 times as deep as said small feature; and
a transition region between said small and large features, wherein said transition region has a maximum depth in said substrate which is less than about half the depth of said large feature. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A microelectronic structure for use in a laser module comprising:
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a large feature for holding a ball lens, wherein the sidewalls of the feature are (111) surfaces;
a small feature to provide a pathway for laser light, wherein the sidewalls of the feature are (111) surfaces;
a metal bonding pad in close proximity to the small feature as a mounting point for a laser; and
a transition region where the small feature and large feature are attached, wherein said transition region has a maximum depth which is less than half of the depth of the large feature. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification