Linear motor coil for exposure apparatus
First Claim
1. A method of producing a coil with a level difference, comprising the steps of:
- winding a conductive foil into a roll to provide a roll coil; and
slicing, by wire cutting, the roll coil so that a coil having a level difference formed thereon is produced.
1 Assignment
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Accused Products
Abstract
A conductive foil is wound into a roll to provide a roll coil, and the roll coil is cut along wire paths, whereby a flat coil with a level difference is produced. Similarly, a flat coil without a level difference is sliced from the roll coil. The flat coil with a level difference and the flat coil without a level difference are then disposed with partial overlapping, while magnet side faces of the coils become coplanar with each other, to provide a unit coil. A plurality of unit coils can be placed juxtaposed with each other, to provide a stator for a linear motor. The number of working operations is reduced significantly, and the reliability of the coil itself is improved.
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Citations
33 Claims
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1. A method of producing a coil with a level difference, comprising the steps of:
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winding a conductive foil into a roll to provide a roll coil; and
slicing, by wire cutting, the roll coil so that a coil having a level difference formed thereon is produced. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A coil with a level difference, said coil comprising:
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a straight portion and a portion with the level difference, in which a conductive material for the coil has a shape defined by winding a conductive foil. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
providing an exposure apparatus as recited in claim 26; and
transferring a pattern formed on a reticle onto a wafer by use of the exposure apparatus.
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31. A device manufacturing method, comprising the steps of:
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providing an exposure apparatus as recited in claim 27; and
transferring a pattern formed on a reticle onto a wafer by use of the exposure apparatus.
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32. A device manufacturing method, comprising the steps of:
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providing an exposure apparatus as recited in claim 28; and
transferring a pattern formed on a reticle onto a wafer by use of the exposure apparatus.
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33. A device manufacturing method, comprising the steps of:
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providing an exposure apparatus as recited in claim 29; and
transferring a pattern formed on a reticle onto a wafer by use of the exposure apparatus.
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Specification