Single unitary plastic package for a magnetic field sensing device

• US 6,265,865 B1
• Filed: 05/14/1999
• Issued: 07/24/2001
• Est. Priority Date: 08/19/1997
• Status: Expired due to Term

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Engel, Raymond W, Gagnon, Jay Gagnon J, Vig, Ravi
• Primary Examiner(s): PATIDAR, JAY M
• Application Number:
  US09/311,868
• Time in Patent Office: 802 Days
• Field of Search: 324/207.2, 324/207.21, 324/207.23, 324/207.24, 324/207.25, 324/251, 324/173, 324/174, 324/207.26, 324/252, 295/95, 735/143.9, 360/113, 338/32.H, 338/32.R, 174/52.2, 264/272.11, 264/272.14, 264/272.15, 264/272.17, 123/406.58, 123/617, 188/181.R, 303/138
• US Class Current: 324/207.2
• CPC Class Codes: G01R 33/07 Hall effect devices
• CPC Class Codes: G01V 3/08 operating with magnetic or electric fields produced or modified by objects or geological structures or by detecting devices with electromagnetic waves G01V3/12
• CPC Class Codes: Y10T 29/49007 Indicating transducer

Abstract

A magnetic field sensor assembly has a magnet, a semiconductor sensor and a metal leadframe encapsulated in a plastic package to form a semiconductor integrated circuit. A metal leadframe has a die attach pad on which the sensor is secured and an assembly having one or more projections for securing the magnet in close proximity to the sensor. The leadframe is made from a metal having sufficient spring tension so that the assembly having the projections will secure the magnet. The sensor is adjacent to a ferromagnetic object and will detect a change in magnetic field caused by the ferromagnetic object. Only a thin layer of the plastic package covers the sensor thus reducing the distance between the sensor and the ferromagnetic object but still maintaining an air gap between the plastic package and the ferromagnetic object sufficient to allow passage of the ferromagnetic object.

Claims

1. A magnetic field sensor comprising:

a) a magnet for creating a magnetic field, said magnet having a magnetic pole at one end thereof;

b) a semiconductor sensor die located within said magnetic field for sensing the strength of said magnetic field;

c) a metal leadframe having a die attach pad, said sensor die being attached to one side of said die attach pad, said one end of said magnet being attached essentially flush against the other side of said die attach pad;

said magnet, sensor die and leadframe comprising a subassembly, said subassembly having been encapsulated by a single transfer-molding step.

2. The magnetic field sensor of claim 1 wherein said magnet is held attached to said die attach pad by at least two finger-like spring loaded projections of said leadframe.

3. The magnetic field sensor of claim 1 wherein said magnet is held attached to the other side of said die attach pad by a cured adhesive between said one pole end of said magnet and said other die-attach-pad side.