Position detecting method and position detecting system
First Claim
Patent Images
1. A position detecting method, comprising the steps of:
- producing a wavefront that provides an optical path length distribution opposite to an optical path length distribution to be defined in accordance with a shape of a light transmissive film on a mark provided on an object to be inspected;
illuminating the mark with the produced wavefront; and
taking an image of the illuminated mark, wherein positional information related to the mark is produced in response to the image taking.
1 Assignment
0 Petitions
Accused Products
Abstract
A position detecting system and method, wherein a wavefront that provides an optical path length distribution opposite to an optical pat length distribution to be defined in accordance with a shape of a light transmissive film on a mark provided on an object to be inspected, is produced, wherein the mark is illuminated with the produced wavefront, and an image of the illuminated mark is taken, such that positional information related to the mark is produced in response to the image taking.
30 Citations
25 Claims
-
1. A position detecting method, comprising the steps of:
-
producing a wavefront that provides an optical path length distribution opposite to an optical path length distribution to be defined in accordance with a shape of a light transmissive film on a mark provided on an object to be inspected;
illuminating the mark with the produced wavefront; and
taking an image of the illuminated mark, wherein positional information related to the mark is produced in response to the image taking. - View Dependent Claims (2, 3, 4)
-
-
5. A position detecting system, comprising:
-
a wavefront producing system for producing a wavefront that provides an optical path length distribution opposite to an optical path length distribution to be defined in acordance with a shape of a light transmissive film on a mark provided on an object to be inspected;
an illumination optical system for illuminating the mark with the produced wavefront; and
an image pickup device for taking an image of the illuminated mark, wherein positional information related to the mark is produced in response to the image taking. - View Dependent Claims (6, 7, 8)
-
-
9. A projection exposure apparatus, comprising:
-
a projection optical system for projecting a pattern of a reticle onto a wafer;
a wavefront producing system for prodducing a wavefront that provides an optical path length distribution to be defined in accordance with a shape of a resist on a mark provided on the wafer;
an illumination optical system for illuminating the mark with the produced wavefront;
an image pickup device for taking an image of the illuminated mark; and
an alignment system for aligning the wafer with respect to the reticle on the basis of the image taking through said image pickup device.
-
-
10. A device manufacturing method, comprising the steps of:
-
producing a wavefront that provides an optical path length distribution opposite to an optical path length distribution to be defined in accordance with a shape of a resist on a mark provided on a wafer;
illuminating the mark with the produced wavefront;
taking an image of the illuminated mark;
aligning the wafer with respect to a reticle on the basis of the image taking;
printing, through projection exposure, a pattern of the reticle to the wafer having been aligned with respect to the reticle; and
developing the resist of the projection-exposed wafer, whereby devices are produced from the developed wafer.
-
-
11. A position detecting method, comprising the steps of:
-
illuminating a mark formed on an object to be inspected, along an oblique direction;
re-illuminating the mark along a perpendicular direction, by use of reflection light from the obliquely illuminated mark; and
taking an image of the re-illuminated mark, wherein positional information related to the mark is produced in response to the image taking. - View Dependent Claims (12, 13)
-
-
14. A position detecting system, comprising:
-
a first illumination system for illuminating a mark formed on an object to be inspected, along an oblique direction;
a second illumination system for re-illuminating the mark along a perpendicular direction, by use of reflection light from the obliquely illuminated mark; and
an image pcikup device for taking an image of the re-illuminated mark, wherein postional information related to the mark is produced in response to the image taking. - View Dependent Claims (15, 16, 17, 18, 19)
-
-
20. A projection exposure apparatus, comprising:
-
a projection optical system for projecting a pattern of a reticle onto a wafer;
a first illuminating system for illuminating a mark formed on the wafer, along an oblique direction;
a second illumination system for re-illuminating the mark along a perpendicular direction, by use of reflection light from the obliquely illuminated mark;
an image pickup device for taking an image of the re-illuminated mark; and
an alignment system for aligning the wafer with respect to the reticle on the basis of the image takiing through said image pickup device.
-
-
21. A device manufacturing method, comprising the steps of:
-
illuminating a mark formed on a wafer along an oblique direction;
re-illuminating the mark along a perpendicular direction, by use of reflection light from the obliquely illuminated mark;
taking an image of the re-illuminated mark;
aligning the wafer with respect to a reticle on the basis of the image taking;
printing, through projection exposure, a pattern of the reticle onto the wafer having been aligned with respect to the reticle; and
developing a resist of the exposed wafer, wherein devices can be produced from the developed wafer.
-
-
22. A position detecting method, comprising the steps of:
-
detecting information related to a shape of a light transmissive film on a mark formed on an object to be inspected;
producing a wavefront on the basis of the shape information, wherein the wavefront is produced so that a plane wave is provided after it is transmitted through the light transmissive film;
illuminating the mark with the produced wavefront; and
taking an image of the illuminated mark, wherein positional information related to the mark is produced in response to the image taking.
-
-
23. A position detecting system, comprising:
-
a wavefront producing system for detecting information related to a shape of a light transmissive film on a mark formed on an object to be inspected, and for producing a wavefront on the basis of the shape information, wherein the wavefront is produced so that a plane wave is provided after it is transmitted through the light transmissive film;
an illumination optical system for illuminating the mark with the produced wavefront; and
an image pickup device for taking an image of the illuminated mark, wherein positional information related to the mark is produced in response to the image taking.
-
-
24. A projection exposure apparatus, comprising:
-
a projection optical system for projecting a pattern of a reticle onto a wafer;
a wavefront producing system for detecting information related to a shape of a resist on a mark formed on the wafer, and for producing a wavefront on the basis of the shape information, wherein the wavefront is produced so that a plane wave is provided after it is transmitted through the resist;
an illumination optical system for illuminating the mark with the produced wavefront;
an image pickup device for taking an image of the illuminated mark; and
an alignment system for aligning the wafer with respect to the reticle, on the basis of the image taking through said image pickup device.
-
-
25. A device manufacturing method, comprising the steps of:
-
detecting information related to a shape of a resist on a mark formed on a wafer;
producing a wavefront on the basis of the shape information, wherein the wavefront is produced so that a plane wave is provided after it is transmitted through the resist;
illuminating the mark with the produced wavefront;
taking an image of the illuminated mark;
aligning the wafer with respect to the reticle, on the basis of the image taking;
printing, through projection exposure, a pattern of the reticle onto the wafer having been aligned with respect to the reticle; and
developing the resist of the exposed wafer, wherein devices can be produced from the developed wafer.
-
Specification