Reduction of haze in tin oxide transparent conductive coatings on glass

• US 6,268,059 B1
• Filed: 05/03/1999
• Issued: 07/31/2001
• Est. Priority Date: 05/20/1992
• Status: Expired due to Fees

• Current Assignee: Donnelly Corporation (Magna International Incorporated)
• Original Assignee: Donnelly Corporation (Magna International Incorporated)
• Inventors: Trosky, Michael, Agrawal, Anoop, Cronin, John P.
• Primary Examiner(s): Beck, Shrive
• Assistant Examiner(s): JOLLEY, KIRSTEN
• Application Number:
  US09/304,187
• Time in Patent Office: 820 Days
• Field of Search: 427/126.2, 427/126.3, 427/108, 427/226, 427/419.3, 427/240, 427/421, 427/430.1, 427/165, 427/168, 427/169, 427/102, 427/110
• US Class Current: 428/432
• CPC Class Codes: C03C 17/3417 all coatings being oxide coatings
• CPC Class Codes: G02B 1/10 Optical coatings produced by application to, or surface treatment of, optical elements G02B1/08 takes precedence

Abstract

The haze in a conductive tin oxide coating deposited on a substrate, particularly glass, can be reduced by applying, to a desired thickness, a solid-state coating, where the solid-state layer is applied as a precursor liquid to the tin oxide layer, is then dried and/or converted to a solid-state film overlying the conductive tin oxide film on the substrate.

Claims

1. A haze-reducing coating on a conductive doped tin oxide film on a substrate formed by:

providing a glass substrate having a conductive doped tin oxide film disposed on a surface thereof, said conductive doped tin oxide substrate having said film thereon exhibiting haze;

providing a coating solution of a metallic oxide precursor in a suitable carrier solvent, said metallic oxide precursor being selected to form one of;

     1) an oxide of an element selected from the group consisting of tungsten, molybdenum, manganese, chromium, rhenium, iridium, zinc, nickel, indium, tin, titanium, zirconium, vanadium, and silicon and

     2) a mixed oxide including an oxide of an element selected from the group consisting of tungsten, molybdenum, manganese, chromium, rhenium, iridium, zinc, nickel, indium, tin, titanium, zirconium, vanadium, and silicon;

coating said conductive doped tin oxide film on said substrate surface with said coating solution by a wet chemical solution deposition process to form a coating of a desired thickness; and

removing said solvent and converting said precursor to a solid-state metal oxide film overlying said conductive doped tin oxide film to reduce the haze present in said conductive film on said substrate surface.

2. A coated substrate in accordance with claim 1 wherein said conductive doped tin oxide film on said substrate surface has a sheet resistance of less than or equal to 20 ohms/square.

3. A coated substrate in accordance with claim 2 wherein said metallic oxide precursor is selected to form a metallic oxide selected from the group consisting of tungsten oxide, molybdenum oxide, manganese oxide, chromium oxide, rhenium oxide, tin oxide, iridium oxide, nickel oxide, titania, and silicon dioxide.

4. A coated substrate in accordance with claim 3 wherein said carrier solvent is a lower carbon alcohol selected from the group consisting of methanol, ethanol, propanol, isopropanol, sec-butanol and mixtures thereof.

5. A coated substrate in accordance with claim 2 wherein said metallic oxide precursor is a metal-peroxy acid ester.

6. A coated substrate in accordance with claim 5 wherein said coating solution is applied to said substrate by a wet chemical solution deposition process selected from the group consisting of dip coating, spin coating, spray deposition and casting.

7. A coated substrate in accordance with claim 6 wherein said converting step comprises heating said coated substrate to a conversion temperature of from about 250°

C. to about 350°

C.

8. A coated substrate in accordance with claim 7 wherein said converting step comprises holding said coated substrate at said conversion temperature for about 15 to 120 minutes.

9. A coated substrate in accordance with claim 1 wherein said conductive doped tin oxide film on said substrate surface has an initial haze level of less than about 30%.

10. A coated substrate in accordance with claim 9 wherein said conductive doped tin oxide film on said substrate surface has an initial haze level of less than about 10%.

11. A coated substrate in accordance with claim 1 in which said metallic oxide precursor is selected to form an electrochromically-active metallic oxide whereby said solid-state metallic oxide film overlying said tin oxide surface is an electrochromically-active metallic oxide film.

12. A coated substrate in accordance with claim 11 wherein said metallic oxide precursor is a metal-peroxy acid ester.

13. A coated substrate in accordance with claim 11 wherein said coating solution is applied to said substrate by a wet chemical solution deposition process selected from the group consisting of dip coating, spin coating, spray deposition and casting.

14. A coated substrate in accordance with claim 13 wherein said converting step comprises heating said coated substrate to a conversion temperature of from about 250°

C. to about 350°

C.

15. A coated substrate in accordance with claim 14 wherein said converting step comprises holding said coated substrate at said conversion temperature for about 15 to about 120 minutes.

16. A coated substrate in accordance with claim 15 wherein said conductive doped tin oxide film on said substrate surface has an initial haze level of less than about 30%.

17. A coated substrate in accordance with claim 16 wherein said conductive doped tin oxide film on said substrate surface has an initial haze level of less than about 10%.

18. A coated substrate in accordance with claim 11 wherein said conductive doped tin oxide film on said substrate surface has a sheet resistance of less than or equal to 20 ohms/square.

19. A coated substrate in accordance with claim 18 wherein said metallic oxide precursor is a metal-peroxy acid ester.

20. A coated substrate in accordance with claim 1 wherein said metallic oxide precursor is a metal-peroxy acid ester.

21. The coated substrate of claim 1 which includes selecting a metallic oxide precursor which will yield an electrically conductive metallic oxide such that said solid-state metal oxide film overlaying said conductive doped tin oxide film on said substrate surface will be conductive.

22. The coated substrate of claim 21 in which said metallic oxide precursor is selected so as to yield upon conversions, a tin oxide layer, a doped tin oxide layer, an indium oxide layer or an indium tin oxide layer.

23. A coated substrate in accordance with claim 21 wherein said conductive doped tin oxide film on said substrate surface has a sheet resistance of less than or equal to 20 ohms/square.

24. A coated substrate in accordance with claim 23 wherein said conductive doped tin oxide film on said substrate surface has an initial haze level of less than about 30%.

25. A coated substrate in accordance with claim 24 wherein said conductive doped tin oxide film on said substrate surface has an initial haze level of less than about 10%.

26. A haze-reducing coating on a substrate having a conductive doped tin oxide film on a surface thereof formed by:

providing a glass substrate having a conductive doped tin oxide film disposed on a surface of said substrate,

providing a solid-state precursor in liquid form, said solid-state precursor in liquid form being selected to form one of;

     1) a solid-state oxide of an element selected from the group consisting of tungsten, molybdenum, manganese, chromium, rhenium, iridium, zinc, nickel, indium, tin, titanium, zirconium, vanadium, and silicon, and

     2) a mixed solid-state oxide including a solid-state oxide of an element selected from the group consisting of tungsten, molybdenum, manganese, chromium, rhenium, iridium, zinc, nickel, indium, tin, titanium, zirconium, vanadium, and silicon;

coating said conductive doped tin oxide film on said substrate surface with said precursor liquid by a wet chemical coating deposition process; and

converting said precursor liquid to a solid-state film overlying said conductive doped tin oxide film to reduce the haze present in said conductive doped tin oxide film on said substrate surface.

27. A coated substrate in accordance with claim 26 wherein said precursor liquid is applied to said substrate by a wet chemical coating deposition process selected from the group consisting of dip coating, spin coating, spray deposition and casting.

28. A haze-reducing coating on a substrate having a conductive doped tin oxide film on a surface thereof formed by:

providing a glass substrate having a conductive doped tin oxide film disposed on a surface of said substrate;

providing a solid-state precursor in liquid form;

coating said conductive doped tin oxide film on said substrate surface with said precursor liquid by a wet chemical coating deposition process selected from the group consisting of dip coating, spin coating, spray deposition and casting; and

converting said precursor liquid to a solid-state film overlying said conductive doped tin oxide film to reduce the haze present in said conductive doped tin oxide film on said substrate surface;

said precursor liquid comprising a carbon polymer precursor.

29. A coated substrate in accordance with claim 28 wherein said conductive doped tin oxide film on said substrate surface has an initial haze level of less than about 30%.

30. A coated substrate in accordance with claim 29 wherein said conductive tin oxide film on said substrate surface has an initial haze level of less than about 10%.

31. A coated substrate in accordance with claim 29 wherein said precursor liquid is an acrylated epoxy urethane polymer.