Method of assembling a peripheral device printed circuit board package

• US 6,269,537 B1
• Filed: 07/28/1999
• Issued: 08/07/2001
• Est. Priority Date: 07/28/1999
• Status: Expired due to Fees

• Current Assignee: Methode Electronics Incorporated
• Original Assignee: Methode Electronics Incorporated
• Inventors: Kimura, Ryan, Allen, Jeffrey, Fajardo, Iggoni, Chao, Michael, Farquhar, James, Weibezhan, Brandt, Herbert, Scott, Hatch, Stephen
• Primary Examiner(s): Young, Lee
• Assistant Examiner(s): Chang, Rick Kiltae
• Application Number:
  US09/362,832
• Time in Patent Office: 741 Days
• Field of Search: 298/32, 298/40, 298/41, 29D/IG.29, 298/83, 298/43, 29D/IG.3, 29D/IG.5, 29D/IG.47, 295/921, 295/275, 298/25, 164/113, 164/900, 264/274, 264/279, 174/35.R, 174/35.GC, 360/97.01, 360/97.02, 360/265.7, 361/685, 361/736, 361/737
• US Class Current: 29/832
• CPC Class Codes: H05K 5/0269 Card housings therefor, e.g. covers, frames, PCB
• CPC Class Codes: Y10S 164/90 Rheo-casting
• CPC Class Codes: Y10S 29/029 Molding with other step
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49988 Metal casting

Abstract

A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Claims

1. A method of assembling a peripheral device printed circuit board package having first and second electrically conductive covers made of a first metallic material, and first and second electrically conductive frames made of a second metallic material, each of the first and second electrically conductive covers having a perimeter, the method comprising the steps of:

placing the second metallic material into a molding machine;

converting the second metallic material to a thixotropic state;

transferring a first amount of the second metallic material in the thixotropic state to a first mold where the first amount of the second metallic material flows around a portion of the perimeter of the first electrically conductive cover so as to form the first electrically conductive frame attached to the perimeter of the first electrically conductive cover, where the first electrically conductive cover is electrically connected to the first electrically conductive frame;

transferring a second amount of the second metallic material in the thixotropic state to a second mold where the second amount of the second metallic material flows around a portion of the perimeter of the second electrically conductive cover so as to form the second electrically conductive frame attached to the perimeter of the second electrically conductive cover, where the second electrically conductive cover is electrically connected to the second electrically conductive frame; and

bonding the first electrically conductive frame to the second electrically conductive frame, where the first electrically conductive frame is electrically connected to the second electrically conductive frame, and wherein, when the first frame is bonded to the second frame, the first and second covers do not physically contact each other.

2. The method of assembling a peripheral device printed circuit board package according to claim 1 wherein the step of transferring the first amount of the second metallic material in the thixotropic state to the first mold includes the first electrically conductive cover having a first side and a second side with a plurality of fingers extending from said sides and wherein edges of the first electrically conductive cover are bent to conform to a shape of the first electrically conductive frame and said fingers are embedded in the first electrically conductive frame forming an integral unit, the first amount of the second metallic material forming the first electrically conductive frame being molded around the fingers, and wherein the step of transferring the second amount of the second metallic material in the thixotropic state to the second mold includes the second electrically conductive cover having a first side and a second side with a plurality of fingers extending from said sides and wherein edges of the second electrically conductive cover are bent to conform to a shape of the second electrically conductive frame and said fingers are embedded in the second electrically conductive frame forming an integral unit, the second amount of the second metallic material forming the second electrically conductive frame being molded around the fingers.

3. A method of forming a part having an object bonded thereto, the method comprising the steps of:

placing a metallic material into a molding machine;

converting the metallic material to a thixotropic state;

inserting at least a portion of the object into a mold;

introducing the metallic material in the thixotropic state into the mold so as to have the metallic material flow around the portion of the object in the mold;

changing state of the metallic material in the thixotropic state to a solid state while being in the mold so as to form the part; and

removing the part from the mold, the part having the object bonded thereto, and wherein

the object is a cover of a peripheral device personal computer card package, and wherein

the part is a frame member of the peripheral device personal computer card package having the cover bonded thereto.

4. A method of forming a part having an object bonded thereto, the method comprising the steps of:

placing a conductive material into a molding machine;

converting the conductive material to a thixotropic state;

inserting at least a portion of the object into a mold;

introducing the conductive material in the thixotropic state into the mold so as to have the conductive material flow around the portion of the object in the mold;

changing state of the conductive material in the thixotropic state to a solid state while being in the mold so as to form the part; and

removing the part from the mold, the part having the object bonded thereto, and wherein

the object is a cover of a peripheral device personal computer card package, and wherein

the part is a frame member of the peripheral device personal computer card package having the cover bonded thereto.