Embedded circuits

• US 6,271,801 B2
• Filed: 05/04/1999
• Issued: 08/07/2001
• Est. Priority Date: 05/01/1997
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Tuttle, Mark E., Lake, Rickie C.
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): VANNUCCI, JAMES
• Application Number:
  US09/305,107
• Publication Number:
  US 20010002826A1
• Time in Patent Office: 826 Days
• Field of Search: 343/872, 343/873, 343/700.MS, 343/866, 343/867
• US Class Current: 343/872
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

The invention includes methods for forming integrated circuits within substrates, and embedded circuits. In one aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a recess in a substrate; b) printing an antenna within the recess; and c) providing an integrated circuit chip and a battery in electrical connection with the antenna. In another aspect, the invention includes a method of forming an integrated circuit within a substrate comprising: a) providing a substrate having a first recess and a second recess formed therein; b) printing a conductive film between the first and second recesses and within the first and second recesses, the conductive film forming electrical interconnects between and within the first and second recesses; c) providing a first electrical component within the first recess and in electrical connection with the electrical interconnects therein; d) providing a second electrical component within the second recess and in electrical connection with the electrical interconnects therein; and e) covering the first electrical component, the second electrical component and the conductive film with at least one protective cover. In another aspect, the invention includes an embedded circuit comprising: a) a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface; b) interconnect circuitry formed on the bottom and sidewall surfaces; and c) an integrated circuit chip within the recess and operatively connected to the interconnect circuitry.

Claims

1. An embedded circuit comprising:

a substrate having a recess therein;

a conductive circuit printed at least partially within the recess;

an integrated circuit chip bonded to the conductive circuit; and

an antenna in electrical connection with the integrated circuit chip.

2. The embedded circuit of claim 1 wherein the antenna is a loop antenna in electrical connection with the integrated circuit chip, the loop antenna comprising a bypass where portions of the antenna cross one another, the bypass comprising a dielectric material between the crossing portions of the antenna.

3. The embedded circuit of claim 2 wherein the portions of the antenna which cross one another are substantially perpendicular to one another.

4. An embedded circuit comprising:

a substrate having a recess therein;

a conductive circuit printed at least partially within the recess;

an integrated circuit chip bonded to the conductive circuit;

a battery in electrical connection with the integrated circuit chip; and

a loop antenna in electrical connection with the integrated circuit chip, the loop antenna comprising a bypass where portions of the antenna cross one another, the bypass comprising a dielectric material between the crossing portions of the antenna.

5. The embedded circuit of claim 4 wherein at least one of the battery and the integrated circuit chip is at least partially within the recess.

6. The embedded circuit of claim 4 wherein the substrate is a card configured for carrying on a person.

7. The embedded circuit of claim 4 further comprising a protective cover formed over the recess.

8. The embedded circuit of claim 4 wherein the portions of the antenna which cross one another are substantially perpendicular to one another.

9. An embedded circuit comprising:

a substrate having a recess therein, the recess having a bottom surface and a sidewall surface joined to the bottom surface;

interconnect circuitry formed on the bottom and sidewall surfaces;

an integrated circuit chip within the recess and operatively connected to the interconnect circuitry;

an antenna electrically connected to the integrated circuit chip; and

a battery within the recess and electrically connected to the interconnect circuitry.

10. The embedded circuit of claim 9 wherein the substrate is a card configured for carrying on a person.

11. The embedded circuit of claim 9 further comprising a protective cover formed over the circuitry.