Method for making a sound transducer integrated into an acoustic signal generating card

• US 6,272,228 B1
• Filed: 09/01/1998
• Issued: 08/07/2001
• Est. Priority Date: 10/26/1995
• Status: Expired due to Fees

• Current Assignee: Gemplus (Thales SA)
• Original Assignee: Gemplus (Thales SA)
• Inventors: Martin, Philippe
• Primary Examiner(s): Kuntz, Curtis
• Assistant Examiner(s): PENDLETON, DIONNE
• Application Number:
  US09/065,087
• Time in Patent Office: 1,071 Days
• Field of Search: 310/8.3, 737/74, 381/191, 381/190, 381/398, 381/392, 381/173, 381/113, 381/114, 379/444
• US Class Current: 381/191
• CPC Class Codes: H04M 1/275 implemented by means of portable electronic directories
• CPC Class Codes: H04R 17/005 using a piezoelectric polymer

Abstract

The invention relates to a sound transducer in fluoride polyvinylidene (FPVD), its process of manufacture and integration into a card producing acoustic signals transmittable by telephone route. The process is chiefly characterized in that it consists of making (10) dual surface metallization strips distributed over the entire width of a ribbon in FPVD of great length and of very narrow thickness, cutting (11) each metallization strip into a unit film, fixing (12) a portion of film onto a pre-determined site of an interconnection array made on the rear surface of the card, cutting away excess film, then placing the film portion under stress (13), in such manner that it may emit acoustic signals when voltage is applied to it.

This process is highly useful for the manufacture of acoustic signal producing cards of very narrow thickness and low cost price.

Claims

1. Sound transducer in fluoride polyvinylidine (FPVD) integrated in a card producing acoustic signals transmittable by telephone route, whose rear surface (100) carries an interconnection array (110), characterized in that it comprises:

grooves (120) parallel to one another, carried by rear surface (100) of the card,

a film portion (25) in FPVD, of very narrow thickness, supporting two electrodes, one lower, one upper, which are connected to interconnection array (110) of the card, and

a stress part (170) whose lower side comprises notches (171) parallel to one another, able to position themselves opposite grooves (120) and to press upon film portion (25) to impart indentations upon it, and

the thickness of stress part (170) fitted with notches (171) being between 0.3 and 0.4 mm.

2. Transducer in accordance with claim 1, characterized in that the thickness of film portion (25) lies between 9 and 12 μ

m.

3. Transducer in accordance with claims 1, to 2, characterized in that it is of rectangular shape, having a width of between 25 and 30 mm and a length of between 27 and 35 mm.

6. Transducer in accordance with any of claims 1, or 2, or 5, or 4, characterized in that grooves (120) have a depth of approximately 0.19 mm.

4. Sound transducer in fluoride polyvinylidine (FPVD) integrated in a card producing acoustic signals transmittable by telephone route, whose rear surface (100) carries an interconnection array (110), characterized in that it comprises:

grooves (120) parallel to one another, carried by rear surface (100) of the card,

a film portion (25) in FPVD, of very narrow thickness, supporting two electrodes, one lower, one upper, which are connected to interconnection array (110) of the card, and

a stress part (170) whose lower side comprises notches (171) parallel to one another, able to position themselves opposite grooves (120) and to press upon film portion (25) to impart indentations upon it, and

stress part (170) forms an integral part of front surface (180) of the card.

5. Transducer in accordance with claim 4, characterized in that the thickness of stress part (170) fitted with notches (171) is between 0.3 and 0.4 mm.

7. Transducer in accordance with any of claims 5 or 4 characterized in that the thickness of film portion (25) lies between 9 and 12 μ

π

.