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Semiconductor wirebond machine leadframe thermal map system

  • US 6,273,605 B1
  • Filed: 02/16/2000
  • Issued: 08/14/2001
  • Est. Priority Date: 10/03/1997
  • Status: Expired due to Term
First Claim
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1. An apparatus for measuring temperatures on a semiconductor die having an active surface having at least one bond pad thereon having one end of a wire bonded thereto in a wire bonding operation and for forming correlations of measured temperatures with locations on said active surface of said semiconductor die at a time of the measurement of said temperatures, said apparatus comprising:

  • a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;

    a sensor probe mount attached to said bonding arm of said wire bonding machine;

    a decay temperature sensor probe having a conductor having a sensing tip located on one end thereof and having an opposite signal output end, said decay temperature probe mounted in said sensor probe mount attached to said bonding arm of said wire bonding machine;

    pulse generating apparatus connected to said opposite signal output end of said decay temperature sensor probe to generate a pulse through said conductor to material at said sensing tip and receiving from said opposite signal output end a signal representative of a temperature at said sensing tip;

    an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

    thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;

    stage apparatus attached to a portion of said wire bond machine for mounting said semiconductor die thereon;

    control apparatus for manipulating a position of said stage apparatus relative to the sensing tip; and

    computing apparatus having software for receiving said temperature indication, and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said active surface of said semiconductor die.

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