Semiconductor wirebond machine leadframe thermal map system

• US 6,273,605 B1
• Filed: 02/16/2000
• Issued: 08/14/2001
• Est. Priority Date: 10/03/1997
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Clyne, Craig T.
• Primary Examiner(s): Gibson, Randy W.
• Application Number:
  US09/505,332
• Time in Patent Office: 545 Days
• Field of Search: 374/137, 374/161, 374/141
• US Class Current: 374/137
• CPC Class Codes: G01K 11/20 using thermoluminescent materials G01K11/32 takes precedence
• CPC Class Codes: G01R 31/2853 Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence

Abstract

A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.

Claims

1. An apparatus for measuring temperatures on a semiconductor die having an active surface having at least one bond pad thereon having one end of a wire bonded thereto in a wire bonding operation and for forming correlations of measured temperatures with locations on said active surface of said semiconductor die at a time of the measurement of said temperatures, said apparatus comprising:

a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said bonding arm of said wire bonding machine;

a decay temperature sensor probe having a conductor having a sensing tip located on one end thereof and having an opposite signal output end, said decay temperature probe mounted in said sensor probe mount attached to said bonding arm of said wire bonding machine;

pulse generating apparatus connected to said opposite signal output end of said decay temperature sensor probe to generate a pulse through said conductor to material at said sensing tip and receiving from said opposite signal output end a signal representative of a temperature at said sensing tip;

an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;

stage apparatus attached to a portion of said wire bond machine for mounting said semiconductor die thereon;

control apparatus for manipulating a position of said stage apparatus relative to the sensing tip; and

computing apparatus having software for receiving said temperature indication, and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said active surface of said semiconductor die.

2. The apparatus of claim 1, wherein said semiconductor die includes at least one bond pad connected to a portion of a leadframe and a semiconductor die having at least one bond pad connected to a portion of a substrate.

3. The apparatus of claim 1, wherein said sensor probe mount comprises a plurality of concentric tubular members connected together for passage of said conductor therethrough and attachment of said decay temperature sensor probe at one end thereof.

4. The apparatus of claim 1, wherein said computing apparatus comprises software for correlating said temperature indication with one of time and location on said active surface of said semiconductor die as a thermal map.

5. The apparatus of claim 1, wherein said sensor probe mount is mountable in a channel of a capillary holder.

6. The apparatus of claim 1, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said bonding arm of said wire bonding machine.

7. An apparatus for measuring temperatures on a semiconductor die having an active surface having a plurality of bond pads thereon having a plurality of wire bonds connected thereto and for forming correlations of measured temperatures with locations on said active surface, said apparatus comprising:

a wire bonding machine including an arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said arm of said wire bonding machine;

a decay temperature sensor probe having a conductor having an end having a sensing tip thereon and an opposite signal output end, said decay temperature sensor probe mounted in said sensor probe mount attached to said arm of said wire bonding machine;

pulse generating apparatus connected to said opposite signal output end of said conductor for generating a pulse of light through said conductor to material at said sensing tip and receiving from said opposite signal output end a signal representative of a temperature at said sensing tip;

an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse of light, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

thermometer apparatus for calculating a temperature indication from said signal representative of a temperature at said sensing tip;

apparatus for mounting said semiconductor die thereon;

control apparatus for manipulating a position of said apparatus for mounting relative to the sensing tip mounted on said arm of said wire bonding machine; and

computing apparatus having software for receiving said temperature indication, and correlating and storing said temperature indication as a function of time and location on said active surface of said semiconductor die.

8. The apparatus of claim 7, wherein said semiconductor die includes at least one semiconductor die connected to a leadframe and at least one other semiconductor die type electronic device connected to a substrate.

9. The apparatus of claim 7, wherein said sensor probe mount comprises a plurality of concentric tubular members connected together for passage of said conductor therethrough and attachment of said decay temperature sensor probe mount at one end thereof.

10. The apparatus of claim 7, wherein said computing apparatus includes software for correlating said temperature indication with time and location on said active surface of said semiconductor die as a thermal map.

11. The apparatus of claim 7, wherein said sensor probe mount is mountable in a channel of a capillary holder.

12. The apparatus of claim 7, wherein said sensor probe mount is mounted in a capillary holder removable from said arm of said wire bonding machine.

13. An apparatus for measuring temperatures on an object having a surface and forming correlations of measured temperatures with locations on said surface, said apparatus comprising:

a wire bonding machine including an arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said arm of said wire bonding machine;

a fluorescence decay temperature sensor probe having a conductor having a sensing tip on one end thereof and having an opposite signal output end, said fluorescence decay temperature sensor probe mountable in said sensor probe mount attached to said arm of said wire bonding machine;

pulse generating apparatus connected to said opposite signal output end for generating a pulse through said conductor to phosphorescent material at said sensing tip and receiving from said opposite signal output end of said conductor a decaying phosphorescent signal representative of a temperature at said sensing tip;

an electronic trigger circuit connected to said wire bonding machine for initiating the generation of said pulse, said electronic trigger circuit initiating a signal for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

thermometer apparatus for calculating a temperature indication from said decaying phosphorescent signal;

a stage apparatus for mounting said object thereon;

control apparatus for manipulating a position of said stage apparatus relative to the sensing tip; and

computing apparatus having software for receiving said temperature indication, and correlating and storing said temperature indication as a function of time and location on said surface of said object.

14. The apparatus of claim 13, wherein said object includes one of a semiconductor die, leadframe, substrate, and other electronic device.

15. The apparatus of claim 13, wherein said sensor probe mount attached to said arm of said wire bonding machine comprises a plurality of connected concentric tubular members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.

16. The apparatus of claim 13, wherein said computing apparatus comprises software for correlating said temperature indication with time and location on said surface as a thermal map.

17. The apparatus of claim 13, wherein said sensor probe mount is mountable in a channel of a capillary holder.

18. The apparatus of claim 13, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said arm of said wire bonding machine.

19. A method for measuring temperatures on an object having a surface and forming correlations of measured temperatures, said method comprising:

providing a wire bonding machine including an arm and an ultrasonic bonding generator controller;

providing a sensor probe mount on said arm of said wire bonding machine;

providing a temperature sensor probe having a conductor having a sensing tip on one end thereof and a signal output end on another end thereof attached to said arm of said wire bonding machine;

initiating generation of a pulse using an electronic trigger circuit connected to said arm of said wire bonding machine, said electronic trigger circuit for a temperature measurement upon receiving a voltage signal comprising an output signal of an ultrasonic bonding generator controller of said wire bonding machine;

generating a pulse through said conductor to material at said sensing tip via means connected to said signal output end;

receiving from said signal output end a signal representative of a temperature at said sensing tip in a computational apparatus having software; and

calculating a temperature indication from said signal.

20. The method of claim 19, further including the step of:

correlating and storing said temperature indication as a function of time and location on said object surface.

21. The method of claim 20, further including:

mounting said object on a support apparatus; and

manipulating a position of said support apparatus relative to the sensing tip using a control apparatus.

22. The method of claim 19, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe, substrate, and other electronic device.

23. The method of claim 19, wherein said sensor probe mount comprises a plurality of connected members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.

24. The method of claim 20, wherein said correlating said temperature indication with time and location on said surface includes correlating said temperature indication as a thermal map of said object.

25. The method of claim 19, further including

mounting said sensor probe mount in a channel of a capillary holder on said arm of said wire bonding machine.

26. The method of claim 19, further including

permanently mounting said sensor probe mount in a capillary holder removable from said arm.

27. A temperature measuring method for measuring temperatures on an object having a surface and forming correlations of measured temperatures with locations on said surface, said method comprising:

providing a wire bonding machine including an arm, a mounting apparatus, and an ultrasonic bonding generator controller;

mounting a sensor probe mount on said arm of said wire bonding machine;

providing a miniature fluorescence temperature sensor probe having a conductor having a sensing tip end and an opposite signal output end, said miniature fluorescence temperature sensor probe mounted in said sensor probe mount on said arm of said wire bonding machine;

providing an apparatus connected to said opposite signal output end;

initiating a signal using an electronic trigger circuit connected to the wire bonding machine for a temperature measurement upon receiving a voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

generating a light pulse through said conductor to phosphorescent material at said sensing tip end;

receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip end;

initiating the generation of said light pulse using the electronic trigger circuit connected to said wire bonding machine;

calculating a temperature indication from said decaying phosphorescent signal;

mounting said object on said mounting apparatus of said wire bonding machine;

manipulating a position of said mounting apparatus relative to the sensing tip end;

computing and correlating and storing said temperature indication as a function of time and location on said surface of said object using a computational apparatus.

28. The method claim 27, wherein said object includes one of a semiconductor wafer, semiconductor die, leadframe, substrate, and other electronic device.

29. The method of claim 27, wherein said sensor probe mount comprises a plurality of concentric connected tubular members for passage of said conductor therethrough and attachment of said sensor probe mount at one end thereof.

30. The method of claim 27, wherein said computational apparatus includes software for correlating said temperature indication with location on said surface as a thermal map.

31. The method of claim 27, wherein said sensor probe mount is mountable in a channel of a capillary holder.

32. The method of claim 31, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said arm of said wire bonding machine.

33. An apparatus for measuring temperatures on a semiconductor die having an active surface having at least one bond pad thereon having one end of a wire bonded thereto in a wire bonding operation and forming correlations of measured temperatures with locations on said active surface of said semiconductor die at a time of the measurement of said temperatures subsequent to bonding of an end of a wire to said at least one bond pad on said active surface of said semiconductor die, said apparatus comprising:

a wire bonding machine having a bonding arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said bonding arm of said wire bonding machine;

a decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said decay temperature sensor probe mountable in said sensor probe mount attached to said bonding arm of said wire bonding machine;

light pulse generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to material at said sensing tip and receiving from said opposite signal output end a decaying signal representative of a temperature at said sensing tip;

a signal isolation trigger circuit connected to said wire bonding machine for initiating the generation of said light pulse, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

calculating apparatus for calculating a temperature indication from said decaying signal;

stage apparatus for mounting said semiconductor die thereon attached to a portion of said wire bonding machine;

control apparatus for manipulating a position of said stage apparatus relative to the sensing tip; and

computing apparatus having software for receiving said temperature indication, and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said active surface of said semiconductor die subsequent to the bonding of one end of a wire to said at least one bond pad on the active surface of said semiconductor die.

34. The apparatus of claim 33, wherein said semiconductor die includes one of a semiconductor die in wafer form, a semiconductor die having at least one bond pad connected to a portion of a leadframe and other semiconductor die electronic devices.

35. The apparatus of claim 33, wherein said sensor probe mount comprises a plurality of concentric tubular members overlappingly fitted together for passage of said fiber-optic conductor therethrough and attachment of said decay temperature sensor probe at one end thereof.

36. The apparatus of claim 33, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said bonding arm of said wire bonding machine.

37. An apparatus for measuring temperatures on a semiconductor die having an active surface having a plurality of bond pads thereon having a plurality of wire bonds connected thereto and forming correlations of measured temperatures with locations on said active surface, said apparatus comprising:

a wire bonding machine having an arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said arm of said wire bonding machine;

a decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said decay temperature sensor probe mounted in said sensor probe mount attached to said arm of said wire bonding machine;

light pulse generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to material at said sensing tip and receiving from said opposite signal output end a decaying signal representative of a temperature at said sensing tip;

a signal isolation trigger circuit connected to said wire bonding machine for initiating the generation of said light pulse, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

calculating apparatus for calculating a temperature indication from said decaying signal;

apparatus for mounting said semiconductor die thereon located on a portion of said wire bonding machine;

control apparatus for manipulating a position of said apparatus for mounting relative to the sensing tip mounted on said arm of said wire bonding machine; and

computing apparatus having software for receiving said temperature indication, and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said active surface of said semiconductor die.

38. The apparatus of claim 37, wherein said semiconductor die includes one of a semiconductor die in wafer form, a semiconductor die connected to a leadframe and other semiconductor die type electronic devices.

39. The apparatus of claim 37, wherein said sensor probe mount is permanently mounted in a capillary holder removable from said arm of said wire bonding machine.

40. An apparatus for measuring temperatures on an object having a surface and forming correlations of measured temperatures with locations on said surface, said apparatus comprising:

a wire bonding machine having an arm and an ultrasonic bonding generator controller;

a sensor probe mount attached to said arm of said wire bonding machine;

a fluorescence decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said fluorescence decay temperature sensor probe mountable in said sensor probe mount attached to said arm of said wire bonding machine;

light pulse generating apparatus connected to said opposite signal output end for generating a pulse of light through said fiber optic conductor to phosphorescent material at said sensing tip and receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip;

a signal isolation trigger circuit connected to said wire bonding machine for initiating the generation of said light pulse, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

calculating apparatus for calculating a temperature indication from said decaying phosphorescent signal;

a stage for mounting said object thereon on a portion of said wire bonding machine;

control apparatus for manipulating a position of said stage relative to the sensing tip; and

computing apparatus having software for receiving said temperature indication, and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said surface of said object.

41. The apparatus of claim 40, wherein said sensor probe mount attached to said arm of said wire bonding machine comprises a plurality of concentric tubular members overlappingly fitted together for passage of said fiber-optic conductor therethrough and attachment of said fluorescence decay temperature sensor probe at one end thereof.

42. The apparatus of claim 40, wherein said computing apparatus comprises software for correlating said temperature indication with one of time and location on said surface as a thermal map.

43. A method for measuring temperatures on an object having a surface and forming correlations of measured temperatures, said method comprising:

providing a wire bonding machine having an arm and an ultrasonic bonding generator controller;

providing a sensor probe mount on said arm of said wire bonding machine;

providing a decay temperature sensor probe having a fiber optic conductor with a sensing tip and a signal output end attached to said arm of said wire bonding machine;

initiating generation of a light pulse using a signal isolation trigger circuit connected to said arm of said wire bonding machine, said signal isolation trigger circuit for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of an ultrasonic bonding generator controller of said wire bonding machine;

generating a pulse of light through said fiber optic conductor to material at said sensing tip via means connected to said signal output end;

receiving from said signal output end a signal representative of a temperature at said sensing tip in machine-readable form in a computational apparatus having software; and

calculating a temperature indication from said electrical voltage signal.

44. The method of claim 43, further including:

mounting said object on a support apparatus; and

manipulating a position of said support apparatus relative to the sensing tip using a control apparatus.

45. The method of claim 43, wherein said sensor probe mount comprises a plurality of tubular members fitted together for passage of said fiber-optic conductor therethrough and attachment of said sensor probe at one end thereof.

46. The method of claim 43, further including:

correlating said temperature indication with one of time and location on said surface as a thermal map of said object.

47. A method for measuring temperatures on an object having a surface and forming correlations of measured temperatures with locations on said surface at a time of the measurement of said temperatures, said method comprising:

providing a wire bonding apparatus having an arm and an ultrasonic bonding generator controller;

providing a sensor probe mount attached to a portion of said arm of said wire bonding apparatus;

providing a decay temperature sensor probe having a fiber optic conductor with a sensing tip and a signal output end;

mounting said decay temperature sensor probe in said sensor probe mount attached to said portion of said arm of said wire bonding apparatus;

initiating generation of a light pulse using a signal isolation trigger circuit connected to said wire bonding apparatus, said signal isolation trigger circuit initiating a signal for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding apparatus;

generating a pulse of light through said fiber optic conductor to material at said sensing tip via apparatus connected to said signal output end;

receiving from said signal output end a signal representative of a temperature at said sensing tip in machine-readable form in a computational apparatus having software;

calculating a temperature indication from said signal; and

correlating and storing said temperature indication as a function of one of time and location on said surface of said object.

48. A method for measuring temperatures on an object having a surface and forming correlations of measured temperatures with locations on said surface, said method comprising:

providing a wire bonding machine having an arm, a mounting apparatus, and an ultrasonic bonding generator controller;

mounting a sensor probe mount to said arm of said wire bonding machine;

providing a miniature fluorescence decay temperature sensor probe having a fiber optic conductor with a sensing tip and an opposite signal output end, said miniature fluorescence decay temperature sensor probe mounted in said sensor probe mount of said arm of said wire bonding machine;

providing an apparatus connected to said opposite signal output end;

initiating a signal using a signal isolation trigger circuit connected to the wire bonding machine for a temperature measurement upon receiving an electrical voltage signal comprising an output signal of said ultrasonic bonding generator controller of said wire bonding machine;

generating a pulse of light through said fiber optic conductor to phosphorescent material at said sensing tip;

receiving from said opposite signal output end a decaying phosphorescent signal representative of a temperature at said sensing tip;

initiating the generation of said light pulse using the signal isolation trigger circuit connected to said wire bonding machine;

calculating a temperature indication from said decaying phosphorescent signal;

mounting said object on said mounting apparatus of said wire bonding machine;

manipulating a position of said mounting apparatus relative to the sensing tip;

computing and correlating and storing said temperature indication in machine-readable form as a function of one of time and location on said surface of said object using a computational apparatus.