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Remote plasma cleaning method for processing chambers

  • US 6,274,058 B1
  • Filed: 07/02/1999
  • Issued: 08/14/2001
  • Est. Priority Date: 07/11/1997
  • Status: Expired due to Fees
First Claim
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1. A method of cleaning from a processing chamber deposits formed on interior surfaces of the processing chamber wherein said processing chamber interior surfaces include a first region and a second region said second region being different from said first region, said method comprising the steps of:

  • (a) dissociating a gas mixture outside said processing chamber to form reactive species, said gas mixture comprising an inert gas and a cleaning gas;

    (b) providing said reactive species to said processing chamber;

    (c) reacting said reactive species with said deposits in said processing chamber first region;

    (d) forming volatile compounds from said deposits formed in said processing chamber first region;

    (e) removing from said processing chamber said volatile compounds formed from deposits formed in said processing chamber first region;

    (f) increasing the fluid communication between said processing chamber first and second regions;

    (g) reacting said reactive species with said deposits in said processing chamber second region;

    (h) forming volatile compounds from said deposits formed in said processing chamber second region; and

    (i) removing from said processing chamber said volatile compounds formed from deposits formed in said processing chamber second region.

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