Method and apparatus for maintaining test data during fabrication of a semiconductor wafer

• US 6,274,395 B1
• Filed: 12/23/1999
• Issued: 08/14/2001
• Est. Priority Date: 12/23/1999
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Weber, David M.
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): STEVENSON, ANDRE C
• Application Number:
  US09/471,842
• Time in Patent Office: 600 Days
• Field of Search: 438/14, 438/15, 438/259, 438/261, 364/579, 365/103, 257/411
• US Class Current: 438/14
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: G01R 31/318505 Test of Modular systems, e.g. Wafers, MCM's
• CPC Class Codes: G01R 31/318511 Wafer Test
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of fabricating a semiconductor wafer includes the step of fabricating a number of die on the wafer. The method also includes the step of fabricating a memory device on the wafer. The method further includes the step of testing the number of die with a die testing apparatus so as to obtain test data associated with the number of die. In addition, the method includes the step of storing the test data obtained during the testing step in the memory device. Moreover, the method includes the step of retrieving the test data from the memory device. Yet further, the method includes the step of operating a packaging apparatus so as to package a first die of the number of die based on the test data. A semiconductor wafer is also disclosed.

Claims

1. A method of fabricating a semiconductor wafer, comprising the steps of:

fabricating a number of die on said wafer;

fabricating a memory device on said wafer;

testing said number of die with a die testing apparatus so as to obtain test data associated with said number of die; and

storing said test data obtained during said testing step in said memory device.

2. The method of claim 1, wherein:

said testing step includes the steps of (i) performing a functional test on a first die of said number of die with said die testing apparatus, and (ii) generating a die-pass control signal if said first die of said number of die passes said functional test, and

said storing step includes the step of storing a pass record in a data location associated with said first die of said number of die in said memory device in response to generation of said die-pass control signal.

3. The method of claim 1, wherein:

said testing step includes the steps of (i) performing a functional test on a first die of said number of die with said die testing apparatus, and (ii) generating a die-fail control signal if said first die of said number of die fails said functional test, and

said storing step includes the step of storing a fail record in a data location associated with said first die of said number of die in said memory device in response to generation of said die-fail control signal.

4. The method of claim 1, wherein:

said testing step includes the step of obtaining parametric data associated with a performance characteristic of a first die of said number of die, and

said storing step includes the step of storing a record which includes said parametric data in a data location associated with said first die of said number of die in said memory device.

5. The method of claim 1, further comprising the steps of:

retrieving said test data from said memory device; and

operating a packaging apparatus so as to package a first group of said number of die based on said test data.

6. The method of claim 5, further comprising the step:

operating said packaging apparatus so as to disregard a second group of said number of die based on said test data.

7. The method of claim 1, wherein:

said memory device includes a non-volatile memory device, and

said storing step includes the step of storing said test data obtained during said testing step in said non-volatile memory device.

8. The method of claim 7, wherein said memory device fabricating step includes the step of fabricating said non-volatile memory device on said wafer.

9. The method of claim 8, wherein said non-volatile memory device includes a flash memory device.

10. The method of claim 1, wherein said die fabricating step and said memory device fabricating step are performed contemporaneously.

11. A method of fabricating a semiconductor wafer, comprising the steps of:

fabricating a number of die on said wafer;

fabricating a memory device on said wafer;

testing said number of die with a die testing apparatus so as to obtain test data associated with said number of die;

storing said test data obtained during said testing step in said memory device;

retrieving said test data from said memory device; and

operating a packaging apparatus so as to package a first die of said number of die based on said test data.

12. The method of claim 11, further comprising the step:

operating said packaging apparatus so as to disregard a second die of said number of die based on said test data.

13. The method of claim 12, wherein:

said testing step includes the steps of (i) performing a functional test on said first die of said number of die with said die testing apparatus, and (ii) generating a die-pass control signal if said first die of said number of die passes said functional test,

said storing step includes the step of storing a pass record in a data location associated with said first die of said number of die in said memory device in response to generation of said die-pass control signal,

said retrieving step includes the step of retrieving said pass record from said data location associated with said first die of said number of die in said memory device, and

said operating step includes the step of operating said packaging apparatus so as to package said first die of said number of die based on said pass record.

14. The method of claim 12, wherein:

said testing step includes the steps of (i) performing a functional test on said second die of said number of die with said die testing apparatus, and (ii) generating a die-fail control signal if said second die of said number of die fails said functional test,

said storing step includes the step of storing a fail record in a data location associated with said second die of said number of die in said memory device in response to generation of said die-fail control signal,

said retrieving step includes the step of retrieving said fail record from said data location associated with said second die of said number of die in said memory device, and

said operating step includes the step of operating said packaging apparatus so as to package said second die of said number of die based on said fail record.

15. The method of claim 11, wherein:

said memory device includes a non-volatile memory device, and

said storing step includes the step of storing said test data obtained during said testing step in said non-volatile memory device, and

said memory device fabricating step includes the step of fabricating said non-volatile memory device on said wafer.

16. The method of claim 15, wherein said non-volatile memory device includes a flash memory device.

17. The method of claim 11, wherein said die fabricating step and said memory device fabricating step are performed contemporaneously.