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Epoxy/thermoplastic photocurable adhesive composition

  • US 6,274,643 B1
  • Filed: 07/26/2000
  • Issued: 08/14/2001
  • Est. Priority Date: 05/01/1998
  • Status: Active Grant
First Claim
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1. A curable composition formed by mixing components comprising:

  • a) from about 20 to about 80 weight percent of a curable epoxy resin;

    b) from about 20 to about 80 weight percent of a thermoplastic ethylene-vinyl acetate copolymer resin; and

    c) an effective amount of a sulfonium or cationic organometallic salt photocatalyst for the curable epoxy resin, such that the total of components a) and b) is 100 weight percent and wherein the composition is free from hydrocarbon polyolefins and solvent and is a homogeneous mixture.

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